Title: PCB Design for Real-World EMI Control, Author: Bruce R. Archambeault
Title: EMC and the Printed Circuit Board: Design, Theory, and Layout Made Simple, Author: Mark I. Montrose
Title: The Boundary-Scan Handbook, Author: Kenneth P. Parker
Title: Placement and Routing of Electronic Modules, Author: Michael Pecht
Title: EMC at Component and PCB Level, Author: MSc Physical Measurement Techniques and Instrument O 'Hara BSc (Hons) Applied Physics and Electronics
Title: Signal Propagation on Interconnects, Author: Hartmut Grabinski
Title: Integrated Passive Component Technology, Author: Richard K. Ulrich
Title: Analog and Mixed-Signal Boundary-Scan: A Guide to the IEEE 1149.4 Test Standard, Author: Adam Osseiran
Title: Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly, Author: Jennie S. Hwang
Title: Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly, Author: Jennie Hwang
Title: Printed Organic and Molecular Electronics, Author: Daniel R. Gamota
Title: Power Systems-On-Chip: Practical Aspects of Design, Author: Bruno Allard
Title: Boundary-Scan Test: A Practical Approach, Author: Harry Bleeker
Title: Soldering Handbook For Printed Circuits and Surface Mounting, Author: Howard H. Manko
Title: Design Of Rf And Microwave Amplifiers And Oscillators, Author: Pieter L. D. Abrie
Title: Printed Circuit Engineering: Optimizing for Manufacturability, Author: Raymond H. Clark
Title: In-Circuit Testing, Author: John T. Bateson
Title: Placement and Routing of Electronic Modules, Author: Michael Pecht
Title: High-Speed Circuit Board Signal Integrity, Author: Stephen C. Thierauf
Title: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging, Author: Xing-Chang Wei

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