Title: Handbook Of Tape Automated Bonding / Edition 1, Author: John H. Lau
Title: Mechanical Analysis of Electronic Packaging Systems / Edition 1, Author: Mckeown
Title: Thermal Design of Electronic Equipment / Edition 1, Author: Ralph Remsburg
Title: Failure Modes and Mechanisms in Electronic Packages / Edition 1, Author: P. Singh
Title: The Basics of Soldering / Edition 1, Author: Armin Rahn
Title: Manufacturing Challenges in Electronic Packaging / Edition 1, Author: Y.C. Lee
Title: Quality Conformance and Qualification of Microelectronic Packages and Interconnects / Edition 1, Author: Michael Pecht
Title: Contamination of Electronic Assemblies / Edition 1, Author: Elissa M. Bumiller
Title: Guidebook for Managing Silicon Chip Reliability / Edition 1, Author: Michael Pecht
Title: MCM C/Mixed Technologies and Thick Film Sensors / Edition 1, Author: W.K. Jones
Title: High Temperature Electronics / Edition 1, Author: F. Patrick McCluskey
Title: Electronic Equipment Packaging Technology / Edition 1, Author: Gerald L. Ginsberg
Title: The Electronic Packaging Handbook / Edition 1, Author: Glenn R. Blackwell
Title: The Handbook of Machine Soldering: SMT and TH / Edition 3, Author: Ralph W. Woodgate
Title: Laser Diode Chip and Packaging Technology, Author: Pei C. Chen
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing / Edition 1, Author: Shen Liu
Title: Microscale Heat Transfer - Fundamentals and Applications: Proceedings of the NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems, Cesme-Izmir, Turkey, 18-30 July, 2004 / Edition 1, Author: S. Kakaï
Title: Advanced Materials for Thermal Management of Electronic Packaging / Edition 1, Author: Xingcun Colin Tong
Title: Fundamentals and Essentials of Electronic Packaging, Author: Puligandla Viswanadham
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach / Edition 1, Author: Pradeep Lall

Pagination Links