3D Integration for VLSI Systems

by Chuan Seng Tan (Editor), Kuan-Neng Chen (Editor), Steven J. Koester (Editor)

Overview

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th

Product Details

ISBN-13:	9781040000106
Publisher:	Jenny Stanford Publishing
Publication date:	04/19/2016
Sold by:	Barnes & Noble
Format:	eBook
Pages:	350
File size:	38 MB
Note:	This product may take a few minutes to download.

About the Author

Chuan Seng Tan, Kuan-Neng Chen

Table of Contents

3D Integration Technology - Introduction and Overview. A Systems Perspective on 3D Integration: What is 3D? And What is 3D Good For? Wafer Bonding Techniques. TSV Etching. TSV Filling. 3D Technology Platform: Temporary Bonding and Release. 3D Technology Platform: Wafer Thinning, Stress Relief, and Thin Wafer Handling. Advanced Die-to-Wafer 3D Integration Platform: Self-Assembly Technology. Advanced Direct Bond Technology. Surface Modification Bonding at Low Temperature for Three-Dimensional Hetero-Integration. Through Silicon Via Implementation in CMOS Image Sensor Product. A 300-mm Wafer-Level Three-Dimensional Integration Scheme Using Tungsten Through- Silicon Via and Hybrid Cu-Adhesive Bonding. Power Delivery in 3D IC Technology with a Stratum Having an Array of Monolithic DC-DC Point-of-Load (PoL) Converter Cells. Thermal-Aware 3D IC Designs. 3D IC Design Automation Considering Dynamic Power and Thermal Integrity. Outlook.

Editorial Reviews

"3D integration is expected to deliver performance improvement and functional enhancement in future integrated circuits and systems. This book covers a wide range of 3D integration topics authored by an impressive selection of experts. This is a great reference source for everyone following this promising technology."
—Prof. L. Rafael Reif - Provost and Maseeh Professor of Emerging Technology, MIT, USA

"3D integration is expected to deliver performance improvement and functional enhancement in future integrated circuits and systems. This book covers a wide range of 3D integration topics authored by an impressive selection of experts. This is a great reference source for everyone following this promising technology."
—Prof. L. Rafael Reif - Provost and Maseeh Professor of Emerging Technology, MIT, USA

From the Publisher