Advanced Metallization Conference 2000 (AMC 2000): Volume 16

Advanced Metallization Conference 2000 (AMC 2000): Volume 16

by Dan Edelstein, G. Dixit, Y. Yasuda, T. Ohba
     
 

This book focuses on recent work in on-chip interconnects and other aspects of advanced metallization. In particular, the concentration for this year's volume is on the rapid advances in copper and low-K. The volume is divided into nine parts: Part I contains an invited perspective on the state of semiconductor research and development in Japan; Part II focuses

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Overview

This book focuses on recent work in on-chip interconnects and other aspects of advanced metallization. In particular, the concentration for this year's volume is on the rapid advances in copper and low-K. The volume is divided into nine parts: Part I contains an invited perspective on the state of semiconductor research and development in Japan; Part II focuses on performance aspects of interconnect architectures; Part III includes some of the most significant recent advances in copper/low-K integration; Part IV is an in-depth collection of electrochemical and chemical processes, mainly pertaining to copper; Part V contains state-of-the-art papers on thin-film diffusion barriers, again mainly for copper wiring; Part VI covers reliability engineering and results; Part VII is a collection of alternative and novel processes and systems related to circuit interconnection; Part VIII contains papers on specific low-K dielectrics and their properties, and new methods for their characterization; and Part IX covers continuing advances in the Al(Cu)/W metallization system.

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Editorial Reviews

Describing the state of semiconductor research, performance aspects of interconnect architectures, recent advances in copper/low-k integration, electrochemical and chemical processes relating to copper, thin-film diffusion barriers, reliability engineering, alternative and novel processes and systems for circuit inteconnection, characterization of low-k dielectrics, and advances in the Al(Cu)/W metalization system, 100 papers reflect the proceedings of two conferences held in October of 2000—one in San Diego, and the other in Tokyo. Annotation c. Book News, Inc., Portland, OR (booknews.com)

Product Details

ISBN-13:
9781558995741
Publisher:
Materials Research Society
Publication date:
01/28/2001
Series:
MRS Proceedings Series
Pages:
706
Product dimensions:
6.40(w) x 9.30(h) x 1.70(d)

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