Controlling Conducted Emissions by Design

Paperback (Softcover reprint of the original 1st ed. 1991)
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Editorial Reviews

Booknews
Fluke explains how to solve costly electromagnetic compatibility problems in electronic equipment and power supplies by using available software. He presents an innovative modeling solution that saves time and money and allows engineers to "design in" electromagnetic compatibility rather than tack it on at the end of the design process. Annotation c. Book News, Inc., Portland, OR (booknews.com)
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Product Details

  • ISBN-13: 9789401170260
  • Publisher: Springer Netherlands
  • Publication date: 12/31/2013
  • Edition description: Softcover reprint of the original 1st ed. 1991
  • Pages: 352
  • Product dimensions: 6.00 (w) x 9.00 (h) x 0.73 (d)

Table of Contents

I. Fundamentals of Conducted Emission Design.- 1. Designing for EMC.- 1.1 Noise (EMI).- 1.2 EMI Source, Path, and Victim.- 1.3 Conductive Paths.- 1.4 Conduction or Radiation?.- 1.5 Design to Control Conducted Emissions.- 2. EMI Spectrum.- 2.1 Time and Frequency Domains.- 2.2 Description of FFT Software.- 2.3 Data Interpretation.- 2.4 Bare Bones FFT.- 2.5 Methods of Inputting Data to FFT.- 2.6 An Enhanced Version of FFT.- 2.7 Examples of FFT Conversions from Time to Frequency Domains.- 2.8 Some Possible Pitfalls.- 2.9 Subharmonics.- 3. Capacitor Modeling.- 3.1 The Capacitor Model.- 3.2 Parasitic Elements of Capacitors.- 3.3 Capacitor Types.- 3.4 Capacitor Voltage Ratings.- 4. Inductor Modeling.- 4.1 Inductor Losses.- 4.2 Inductor Capacitance.- 4.3 Air Core with Conductor Near Experiment.- 4.4 Inductor Cores Form Capacitive Paths.- 4.5 Inductor Impedance Curve.- 4.6 Parasitic Elements of Inductors.- 4.7 Simulation.- 5. Balun Modeling.- 5.1 Differential Mode Flux.- 5.2 Common Mode Flux.- 5.3 The Truth about Windings on Inductor Cores.- 5.4 Coupling K Factor.- 5.5 Differential Balun Inductance.- 5.6 Common Mode Balun Inductance.- 5.7 Effects of Load and Source Resistances on Attenuation.- 5.8 Balun Driving Impedance.- 5.9 Balanced Circuits.- 5.10 Design Criteria.- 5.11 Model.- 6. Filters.- 6.1 Parasitic Inductances and Capacitances.- 6.2 Academic LC Filter.- 6.3 Simple Real World LC Filter.- 6.4 Control Parasitics by Design.- 6.5 Parasitics Caused by Circuit Layout.- 6.6 Filter Circuit Design.- 6.7 Characteristic Impedance of LC Filters.- 6.8 Parallel Capacitors to Lower the ESR.- 6.9 LC Filter.- 6.10 Line Impedance Stabilization Networks.- 6.11 Filter Layout and Packaging Design.- 7. Grounding Electronic Circuits.- 7.1 Grounding.- 7.2 Safety Grounds.- 7.3 Ground Geometries.- 7.4 Ground Design for Packaging ElectronicCircuitry.- 7.5 Shielding.- 8. EMI Analysis.- 8.1 EMI Modeling.- 8.2 EMI Analysis Using SPICE.- II. Advanced Conducted Emission Design.- 9. EMC Regulations.- 9.1 FCC.- 9.2 VDE.- 9.3 MIL-STD-461.- 9.4 Voltage/LISN Measurement Method.- 9.5 Current/Capacitor Measurement Method.- 9.6 A Comparison of Some of the RF Conducted Emissions Standards.- 10. Switch Mode Power Supplies.- 10.1 Typical Power Supply Block Diagram.- 10.2 Typical Switch Mode Power Supply EMI Problem Areas.- 10.3 EMI Simulation and Laboratory EMI Test Setup.- 10.4 SMPS EMI Design Example.- 10.5 Model the Problem.- 10.6 Simulation Problems.- 10.7 Back to Fundamental Model.- 10.8 Identify the Players.- 10.9 Other Types of EMI Modeling for SMPS.- 10.10 Conclusion.- 11. Transistor and Diode Packaging Problem for EMI.- 11.1 New Semiconductor Device Packages.- 11.2 Common Mode Shorting Screens.- 11.3 Typical System with Power Conversion.- 11.4 Common Mode Current Paths.- 11.5 Conducted Emissions Reduction by Choice of Package.- 12. Circuit Examples.- 12.1 Example 1.- 12.2 Example 2.- 12.3 Example 3 (FFT).- 13. Computers and Digital Logic Circuitry.- 13.1 Conducted Emissions Coupling Paths.- 13.2 Sequential Logic and Clocks.- 13.3 Example of Internal Conducted Emissions.- 13.4 What Is the Best Bypass Capacitor?.- 13.5 Power Entry Capacitor.- 14. What This Analysis Method Is Not.- 14.1 Diagnostics.- 14.2 Fields.- 14.3 Radiation.- 14.4 Characteristic Impedances of Common Pairs of Conductors.- 14.5 Shortcomings of EMI Test Simulation as Described Herein.- 15. Magnetic Saturation Modeling.- 15.1 The Polarization of Magnetic Domains.- 15.2 Device, Core, and Material Properties.- 15.3 Core Geometry Effects.- 15.4 Effects of Cores Made of Two Different Materials.- 15.5 Some Crucial Parameters to Model Saturation.- 15.6 Methods of Integrating Voltage.- 15.7 Dr. Lauritzen’s Saturation Model.- 15.8 The Core Geometry and Material Porosity Region of the B-H Loop.- 15.9 Curve Fitting versus Parametric Models.- 15.10 Conclusion.- Appendix. BASIC FFT.

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