Cooling of Electronic Systems

Overview

Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book.
Cooling of Electronic Systems presents the technical progress achieved in the ...

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1994 Hardback NEAR FINE Hardback, This listing is a new book, a title currently in-print which we order directly and immediately from the publisher. *****PLEASE NOTE: This item ... is shipping from an authorized seller in Europe. In the event that a return is necessary, you will be able to return your item within the US. To learn more about our European sellers and policies see the BookQuest FAQ section***** Read more Show Less

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Overview

Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book.
Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics.
Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.

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Product Details

  • ISBN-13: 9780792327363
  • Publisher: Springer Netherlands
  • Publication date: 2/28/1994
  • Series: Nato Science Series E: (closed) , #258
  • Edition description: 1994
  • Edition number: 1
  • Pages: 961

Table of Contents

Preface
Introduction to ASI on Cooling of Electronic Systems 1
Trends in the Packaging of Computer Systems 17
Beyond Thermal Limits in Computer Systems Cooling 47
Cooling Technology for High Performance Computers: Design Applications 71
Cooling Technology for High Performance Computers: IBM Sponsored University Research 97
Natural Convection Cooling of an Array of Heated Plates Simulating Printed Circuit Boards 123
Convection in Arrays of Electronic Packages Containing Longitudinal Fin Heat Sinks 145
Experiments on Natural Convective Air Cooling of a PCBs Array in a Closed Casing with Inclination 165
Cooling of Multiple Heat Sources Attached to Two Dimensional Rectangular Fins 179
Natural Convection Heat Transfer from Horizontal Rectangular Fin Arrays 189
Cooling of a Microelectronic Sensor by Turbulent Forced Convection 203
Computation of Steady Laminar Natural Convective Heat Transfer from Localized Heat 225
Unsteady Forced Convection in a Duct with and without Array of Block-Like Electronic Components 239
Optimal Geometry of Convection Cooled Electronic Packages 277
A Thermal Design Approach for Electronic Equipment by use of a Personal Computer and Flow Visualization 293
Experimental Visualization of Temperature Fields and Measurement of Heat Transfer Enhancement in Electronic System Models 313
Cooling of Electronic Systems by Impinging Air Jets 339
Numerical and Experimental Studies for the Conjugate Direct Cooling of a Micro Heat Generating Element 361
The Cooling of Electronic Components with Flat Plate Heat Sinks 391
Fundamentals of Nucleate Pool Boiling of Highly-Wetting Dielectric Liquids 415
Single-Phase Liquid Jet Impingement Cooling of High-Performance Chips 457
Application of Channel Flows to Single-Phase Liquid Cooling of Chips and Multi-Chip Modules 507
Immersion Cooling of Digital Computers 539
Boiling Coupled with Air Cooling 623
Thermal Control for Cryogenically Cooled Computer Systems 643
Thermal Contact Conductance-Theory and Applications 677
Analysis of Extended Surface Arrays for Air-Cooled Electronic Equipment 703
The Choking of Finned Arrays 735
Error Analysis and Improved Formulations for Extended Surfaces 753
Determination of the Weighted-Average Case Temperature for a Single Chip Package 789
Network Modelling of Two-Phase Flow in Porous Structures: An Alternative for the Study of Chip Cooling Enhancement 811
Accurate Temperature Prediction in Consumer Electronics: A Must but still a Myth 825
Pragmatic Methods for Determining the Parameters Required for the Thermal Analysis of Electronic Systems 859
Effective Heat Transfer Coefficients and Temperature Modelling in Electronic Systems 899
Information Processing and Heat Transfer Engineering: Some Generic Views on Future Research Needs 911
Research Needs in Thermal Management of Electronic Systems 945
Index 959
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