Digital Signal Integrity: Modeling and Simulation with Interconnects and Packages / Edition 1

Digital Signal Integrity: Modeling and Simulation with Interconnects and Packages / Edition 1

by Brian Young
     
 

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ISBN-10: 0130289043

ISBN-13: 9780130289049

Pub. Date: 10/09/2000

Publisher: Prentice Hall

  • State-of-the-art techniques for predicting and achieving target performance levels
  • Theory, practice, general signal integrity issues, and leading-edge experimental techniques

Model and simulate high-speed digital systems for maximum performance

Maximizing the performance of digital systems means optimizing their high-speed

Overview

  • State-of-the-art techniques for predicting and achieving target performance levels
  • Theory, practice, general signal integrity issues, and leading-edge experimental techniques

Model and simulate high-speed digital systems for maximum performance

Maximizing the performance of digital systems means optimizing their high-speed interconnections. Digital Signal Integrity gives engineers all the theory and practical methods they need to accurately model and simulate those interconnections and predict real-world performance. Whether you're modeling microprocessors, memories, DSPs, or ASICs, these techniques will get you to market faster with greater reliability. Coverage includes:

  • In-depth reviews of inductance, capacitance, resistance, single and multiconductor transmission lines, generalized termination schemes, crosstalk, differential signaling, and other modeling/simulation issues
  • Multiconductor interconnects: packages, sockets, connectors and buses
  • Modal decomposition: understanding the outputs generated by commercial modeling software
  • Layer peeling with time-domain reflectometry: its power and limitations
  • Experimental techniques for characterizing interconnect parasitics

In Digital Signal Integrity, Motorola senior engineer Brian Young presents broad coverage of modeling from data obtained through electromagnetic simulation, transmission line theory, frequency and time-domain modeling, analog circuit simulation, digital signaling, and architecture. Young offers a strong mathematical foundation for every technique, as well as over 100 end-of-chapter problems. If you're stretching the performance envelope, you must be able to rely on your models and simulations. With this book, you can.

Product Details

ISBN-13:
9780130289049
Publisher:
Prentice Hall
Publication date:
10/09/2000
Series:
Prentice Hall Modern Semiconductor Design Series' Sub Series: PH Signal Integrity Library Series
Edition description:
New Edition
Pages:
560
Product dimensions:
7.00(w) x 9.50(h) x 1.30(d)

Table of Contents

1. Digital Systems and Signaling.

Tradeoffs for Performance Enhancement. Signaling Standards and Logic Families. Interconnects. Modeling of Digital Systems.

2. Signal Integrity.

Transmission Lines. Ideal Point-to-Point Signaling. Nonideal Signaling. Discontinuities. Crosstalk. Topology. Simultaneous Switching Noise. System Timing. Exercises.

3. Simultaneous Switching Noise.

Origins of SSN. Effective Inductance. Off-Chip SSN Dependencies. SSN-Induced Skew. Fast Simulation of Banks. Exercises.

4. Multiport Circuits.

Z-and Y-Parameters. S-Parameters. Multiport Conversions Between S-, Y-, and Z-Parameters. Normalization of S-Parameters. Matrix Reductions. Exercises.

5. Inductance.

Summary of an Electromagnetic Result. Definitions of Inductance. Definition of Mutual Inductance. Calculations with Neumann's Formula. Definition of Partial Inductance. Formulas for Partial Self- and Mutual Inductance. Circuit Symbols. Modal Decomposition. Nonuniqueness of Partial Inductance. Open Loop Modeling. Manipulating the Reference Lead. Model Reduction. Exercises.

6. Capacitance.

Definition of Capacitance. Capacitance between Several Conductors. Energy Definition of Capacitance. Frequency Dependence. Circuit Equations with Capacitance. Modal Decomposition and Passivity. Reference and Capacitance. Model Reduction. Exercises.

7. Resistance.

Skin Effect. Current Crowding. PEEC Method. Ladder Networks. Transresistance. Exercises.

8. Measurement of Parasitics.

Measurement Counts. Impedance Analyzer. Vector Network Analyzer. Time-Domain Reflectometer. Tradeoffs. Exercises.

9. Lumped Modeling.

Transmission Line Introduction. Multiconductor Modeling with Two Samples. Multiconductor Modeling with One Sample. Internal Nodes. Frequency Dependence. Iterative Impedance and Bandwidth. Model Reduction. Approaches for Specific Interconnects. General Topology. Multidrop Nets. Exercises.

10. Wideband Modeling.

Transmission Line Lumped Modeling. Coupled Transmission Lines. Skin Effect Models. Black Box Modeling. Exercises.

11. Enhancing Signal Integrity.

Differential Signaling. Termination. Multiconductor Termination. Power Distribution. Advanced Packaging. Exercises.

Appendix A: Solutions to Selected Problems.

Appendix B: Coaxial Peec Calculator.

Appendix C: Sample Spice SSN Simulations.

Appendix D: Sample Modal Decomposition Code.

Appendix E: Sample Layer Peeling Code.

Index.

About the Author.

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