Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

Overview

The first book to address electromagnetic modeling methodologies for analysis of the large complex electronic structures, Efficient Electromagnetic Modeling for High Speed Electronics systematically reviews a series of fast and efficient electromagnetic modeling techniques. The book presents a number of special methods to solve the SI, PI, and EMI problems and provides an overview of the existing electromagnetic modeling methods used in electronic chips, package, and PCB. The text also addresses the limitations ...

See more details below
Other sellers (Hardcover)
  • All (8) from $64.52   
  • New (6) from $69.00   
  • Used (2) from $64.52   
Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

Available on NOOK devices and apps  
  • NOOK Devices
  • Samsung Galaxy Tab 4 NOOK 7.0
  • Samsung Galaxy Tab 4 NOOK 10.1
  • NOOK HD Tablet
  • NOOK HD+ Tablet
  • NOOK eReaders
  • NOOK Color
  • NOOK Tablet
  • Tablet/Phone
  • NOOK for Windows 8 Tablet
  • NOOK for iOS
  • NOOK for Android
  • NOOK Kids for iPad
  • PC/Mac
  • NOOK for Windows 8
  • NOOK for PC
  • NOOK for Mac

Want a NOOK? Explore Now

NOOK Book (eBook)
$70.49
BN.com price
(Save 42%)$123.00 List Price

Overview

The first book to address electromagnetic modeling methodologies for analysis of the large complex electronic structures, Efficient Electromagnetic Modeling for High Speed Electronics systematically reviews a series of fast and efficient electromagnetic modeling techniques. The book presents a number of special methods to solve the SI, PI, and EMI problems and provides an overview of the existing electromagnetic modeling methods used in electronic chips, package, and PCB. The text also addresses the limitations individuals in the real-world engineering community face for design engineers, researchers, postgraduates, postdoctoral researchers, university professors, and consultants.

Read More Show Less

Product Details

  • ISBN-13: 9780470623466
  • Publisher: Wiley
  • Publication date: 4/17/2012
  • Edition number: 1
  • Pages: 384
  • Product dimensions: 6.00 (w) x 9.30 (h) x 1.20 (d)

Meet the Author

ER-PING LI, PhD, holds an appointment as Chair Professor at Zhejiang University, China, and has also been a principal scientist and director at the Institute of High Performance Computing, Singapore. He is a Fellow of the IEEE and a Fellow of the Electromagnetics Academy. He has received numerous awards and honors in recognition of his professional work from the IEEE and other professional bodies. Dr. Li is a pioneer in the modeling and simulation for signal/power and EMC in integrated circuits and electronic systems packaging. He has chaired or spoken at numerous international conferences and universities, and has also served as editor to several IEEE Transactions.

Read More Show Less

Table of Contents

Foreword xi

Preface xiii

1. Introduction 1

1.1 Introduction of Electronic Package Integration, 1

1.2 Review of Modeling Technologies, 6

1.3 Organization of the Book, 10

2. Macromodeling of Complex Interconnects in 3D Integration 16

2.1 Introduction, 16

2.2 Network Parameters: Impedance, Admittance, and Scattering Matrices, 19

2.3 Rational Function Approximation with Partial Fractions, 25

2.4 Vector Fitting (VF) Method, 29

2.5 Macromodel Synthesis, 41

2.6 Stability, Causality, and Passivity of Macromodel, 48

2.7 Macromodeling Applied to High-Speed Interconnects and Circuits, 79

2.8 Conclusion, 91

3. 2.5D Simulation Method for 3D Integrated Systems 97

3.1 Introduction, 97

3.2 Multiple Scattering Method for Electronic Package Modeling with Open Boundary Problems, 98

3.3 Novel Boundary Modeling Method for Simulation of Finite-Domain Power-Ground Planes, 127

3.4 Numerical Simulations for Finite Structures, 133

3.5 Modeling of 3D Electronic Package Structure, 142

3.6 Conclusion, 182

4. Hybrid Integral Equation Modeling Methods for 3D Integration 185

4.1 Introduction, 185

4.2 2D Integral Equation Equivalent Circuit (IEEC) Method, 186

4.3 3D Hybrid Integral Equation Method, 220

4.4 Conclusion, 238

5. Systematic Microwave Network Analysis for 3D Integrated Systems 241

5.1 Intrinsic Via Circuit Model for Multiple Vias in an Irregular Plate Pair, 242

5.2 Parallel Plane Pair Model, 281

5.3 Cascaded Multiport Network Analysis of Multilayer Structure with Multiple Vias, 305

6. Modeling of Through-Silicon Vias (TSV) in 3D Integration 331

6.1 Introduction, 331

6.2 Equivalent Circuit Model for TSV, 336

6.3 MOS Capacitance Effect of TSV, 351

6.4 Conclusion, 356

References, 358

Index 361

Read More Show Less

Customer Reviews

Be the first to write a review
( 0 )
Rating Distribution

5 Star

(0)

4 Star

(0)

3 Star

(0)

2 Star

(0)

1 Star

(0)

Your Rating:

Your Name: Create a Pen Name or

Barnes & Noble.com Review Rules

Our reader reviews allow you to share your comments on titles you liked, or didn't, with others. By submitting an online review, you are representing to Barnes & Noble.com that all information contained in your review is original and accurate in all respects, and that the submission of such content by you and the posting of such content by Barnes & Noble.com does not and will not violate the rights of any third party. Please follow the rules below to help ensure that your review can be posted.

Reviews by Our Customers Under the Age of 13

We highly value and respect everyone's opinion concerning the titles we offer. However, we cannot allow persons under the age of 13 to have accounts at BN.com or to post customer reviews. Please see our Terms of Use for more details.

What to exclude from your review:

Please do not write about reviews, commentary, or information posted on the product page. If you see any errors in the information on the product page, please send us an email.

Reviews should not contain any of the following:

  • - HTML tags, profanity, obscenities, vulgarities, or comments that defame anyone
  • - Time-sensitive information such as tour dates, signings, lectures, etc.
  • - Single-word reviews. Other people will read your review to discover why you liked or didn't like the title. Be descriptive.
  • - Comments focusing on the author or that may ruin the ending for others
  • - Phone numbers, addresses, URLs
  • - Pricing and availability information or alternative ordering information
  • - Advertisements or commercial solicitation

Reminder:

  • - By submitting a review, you grant to Barnes & Noble.com and its sublicensees the royalty-free, perpetual, irrevocable right and license to use the review in accordance with the Barnes & Noble.com Terms of Use.
  • - Barnes & Noble.com reserves the right not to post any review -- particularly those that do not follow the terms and conditions of these Rules. Barnes & Noble.com also reserves the right to remove any review at any time without notice.
  • - See Terms of Use for other conditions and disclaimers.
Search for Products You'd Like to Recommend

Recommend other products that relate to your review. Just search for them below and share!

Create a Pen Name

Your Pen Name is your unique identity on BN.com. It will appear on the reviews you write and other website activities. Your Pen Name cannot be edited, changed or deleted once submitted.

 
Your Pen Name can be any combination of alphanumeric characters (plus - and _), and must be at least two characters long.

Continue Anonymously

    If you find inappropriate content, please report it to Barnes & Noble
    Why is this product inappropriate?
    Comments (optional)