Electron Backscatter Diffraction in Materials Science / Edition 2

Hardcover (Print)
Buy New
Buy New from BN.com
$155.20
Used and New from Other Sellers
Used and New from Other Sellers
from $143.16
Usually ships in 1-2 business days
(Save 26%)
Other sellers (Hardcover)
  • All (8) from $143.16   
  • New (5) from $143.16   
  • Used (3) from $155.19   

Overview

Electron backscatter diffraction is a very powerful and relatively new materials characterization technique aimed at the determination of crystallographic texture, grain boundary character distributions, lattice strain, phase identification, and much more. The purpose of this book is to provide the fundamental basis for electron backscatter diffraction in materials science, the current state of both hardware and software, and illustrative examples of the applications of electron backscatter diffraction to a wide-range of materials including undeformed and deformed metals and alloys, ceramics, and superconductors.

The text has been substantially revised from the first edition, and the authors have kept the format as close as possible to the first edition text. The new developments covered in this book include a more comphrensive coverage of the fundamentals not covered in the first edition or other books in the field, the advances in hardware and software since the first edition was published, and current examples of application of electron backscatter diffraction to solve challenging problems in materials science and condensed-matter physics.

Read More Show Less

Editorial Reviews

Booknews
Provides the fundamental basis for electron backscatter diffraction (EBSD), briefly covers the crystallography required for application, discusses the latest hardware and software available, and describes specific applications of EBSD. Chapter topics include representations of texture in orientation space, automated EBSD, phase identification using EBSD, and three-dimensional orientation imaging. Other topics are buying a system, strategies for analyzing EBSD datasets, use of EBSD data in mesoscale numerical analyses, characterization of deformed microstructures, and continuous recrystallization and grain boundaries in a superplastic aluminum alloy. Schwartz is affiliated with Lawrence Livermore National Laboratory. Annotation c. Book News, Inc., Portland, OR (booknews.com)
Read More Show Less

Product Details

  • ISBN-13: 9780387881355
  • Publisher: Springer US
  • Publication date: 8/12/2009
  • Edition description: 2nd ed. 2009
  • Edition number: 2
  • Pages: 403
  • Product dimensions: 7.80 (w) x 10.30 (h) x 0.90 (d)

Meet the Author

Adam J. Schwartz is the Deputy Division Leader for Condensed Matter and High Pressure Physics in the Physics and Advanced Technologies Directorate. Dr. Schwartz joined LLNL as a post-doctoral research associate to investigate the systematics of displacive phase transformations after receiving his PhD from the University of Pittsburgh in 1991. His areas of interests focus on structure-propoerty-processing relations, aging and phase transformations in actinides; influence of microstructure and impurities on high-strain rate deformation behavior, texture and texture gradients in materials, intercrystalline defects and the role of grain boundary character distribution in materials, conventional and high resolution transmission electron microscopy, and electron backscatter diffraction. Dr. Schwartz has authored over 50 publications and has one patent.

Mukul Kumar joined as a staff scientist in the Materials Science and Technology Division in 1998 after completing a stint as a post-doctoral fellow at Johns Hopkins University. Prior to that, he received his PhD from the University of Cincinnati, where he was an Oak Ridge Institute for Science and Engineering Fellow and also received the ASM International Arthur Focke Award for his dissertation work. His areas of interest include the relationship between properties and microstructures, particularly as related to extreme environments encountered in turbine jet engine and nuclear reactor environments and high strain rate and pressure conditions; defect analysis using conventional transmission electron microscopy; and electron backscatter diffraction. Kumar has authored over 70 publications and has two patents.

Read More Show Less

Table of Contents

List of Contributors. 1. The Development of Automated Diffraction in Scanning and Transmission Electron Microscopy; D.J. Dingley. 2. Theoretical Framework for Electron Backscatter Diffraction; V. Randle. 3. Representation of Texture in Orientation Space; K. Rajan. 4. Rodriques-Frank Representations of Crystallographic Texture; K. Rajan. 5. Fundamentals of Automated EBSD; S.I. Wright. 6. Studies on the Accuracy of Electron Backscatter Diffraction Measurements; M.C. Demirel, B.S. El-Dasher, B.L. Adams, A.D. Rollett. 7. Phase Identification Using Electron Backscatter Diffraction in the Scanning Electron Microscope; J.R. Michael. 8. Three-Dimensional Orientation Imaging; D.J. Jensen. 9. Automated Electron Backscatter Diffraction: Present State and Prospects; R.A. Schwarzer. 10. EBSD: Buying a Systems; A. Eades. 11. Hardware and Software Optimization for Orientation Mapping and Phase Identification; P.P. Camus. 12. An Automated EBSD Acquisition and Processing System; P. Rolland, K.G. Dicks. 13. Advanced Software Capabilities for Automated EBSD; S.I. Wright, D.P. Field, D.J. Dingley. 14. Strategies for Analysis of EBSD Datasets; W.E. King, J.S. Stölken, M. Kumar, A.J. Schwartz. 15. Structure-Property Relations: EBSD-Based Materials-Sensitive Design; B.L. Adams, B.L. Henrie, L.L. Howell, R.J. Balling. 16. Use of EBSD Data in Mesoscale Numerical Analyses; R. Becker, H. Weiland. 17. Characterization of Deformed Microstructures; D.P. Field, H. Weiland. 18. AnisotropicPlasticity Modeling Incorporating EBSD Characterization of Tantalum and Zirconium; J.F. Bingert, G.C. Kaschner, T.A. Mason, P.J. Maudlin, G.T. Gray III. 19. Measuring Strains Using Electron Backscatter Diffraction; A.J. Wilkinson. 20. Mapping Residual Plastic Strain in Materials Using Electron Backscatter Diffraction; E.M. Lehockey, Yang-Pi Lin, O.E. Lepik. 21.EBSD Contra TEM Characterization of a Deformed Aluminum Single Crystal; Xiaoxu Huang, D.J. Jensen. 22. Continuous Recrystallization and Grain Boundaries in a Superplastic Aluminum Alloy; T.R. McNelley. 23. Analysis of Facets and Other Surfaces Using Electron Backscatter Diffraction; V. Randle. 24. EBSD of Ceramic Materials; J.K. Farrer, J.R. Michael, C.B. Carter. 25. Grain Boundary Character Based Design of Polycrystalline High Temperature Superconducting Wires; A. Goyal. Index.

Read More Show Less

Customer Reviews

Be the first to write a review
( 0 )
Rating Distribution

5 Star

(0)

4 Star

(0)

3 Star

(0)

2 Star

(0)

1 Star

(0)

Your Rating:

Your Name: Create a Pen Name or

Barnes & Noble.com Review Rules

Our reader reviews allow you to share your comments on titles you liked, or didn't, with others. By submitting an online review, you are representing to Barnes & Noble.com that all information contained in your review is original and accurate in all respects, and that the submission of such content by you and the posting of such content by Barnes & Noble.com does not and will not violate the rights of any third party. Please follow the rules below to help ensure that your review can be posted.

Reviews by Our Customers Under the Age of 13

We highly value and respect everyone's opinion concerning the titles we offer. However, we cannot allow persons under the age of 13 to have accounts at BN.com or to post customer reviews. Please see our Terms of Use for more details.

What to exclude from your review:

Please do not write about reviews, commentary, or information posted on the product page. If you see any errors in the information on the product page, please send us an email.

Reviews should not contain any of the following:

  • - HTML tags, profanity, obscenities, vulgarities, or comments that defame anyone
  • - Time-sensitive information such as tour dates, signings, lectures, etc.
  • - Single-word reviews. Other people will read your review to discover why you liked or didn't like the title. Be descriptive.
  • - Comments focusing on the author or that may ruin the ending for others
  • - Phone numbers, addresses, URLs
  • - Pricing and availability information or alternative ordering information
  • - Advertisements or commercial solicitation

Reminder:

  • - By submitting a review, you grant to Barnes & Noble.com and its sublicensees the royalty-free, perpetual, irrevocable right and license to use the review in accordance with the Barnes & Noble.com Terms of Use.
  • - Barnes & Noble.com reserves the right not to post any review -- particularly those that do not follow the terms and conditions of these Rules. Barnes & Noble.com also reserves the right to remove any review at any time without notice.
  • - See Terms of Use for other conditions and disclaimers.
Search for Products You'd Like to Recommend

Recommend other products that relate to your review. Just search for them below and share!

Create a Pen Name

Your Pen Name is your unique identity on BN.com. It will appear on the reviews you write and other website activities. Your Pen Name cannot be edited, changed or deleted once submitted.

 
Your Pen Name can be any combination of alphanumeric characters (plus - and _), and must be at least two characters long.

Continue Anonymously

    If you find inappropriate content, please report it to Barnes & Noble
    Why is this product inappropriate?
    Comments (optional)