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Proceedings of the ASME International Mechanical Engineering Congress and Exposition, November 13-19, 2004, Anaheim, California. Printed compilation consisting of 75 full-length, peer-reviewed papers on the following topics: Electroncis and Photonics Packaging: Heat Transfer; Heat Transfer in Electronic Equipment; Mechanics of Surface Mount Assemblies and Photonic Structures; MEMS/NEMS Packaging; Nanoscale Materials and Mechanics for Electronic Packaging, Quality and Reliability. Electrical Systems Design and Photonics: Technology Transfer. Nanotechnology: Design and Fabrication Techniques; Diagnostics and Measurement Techniques and Requirements of Standards; Engineering and Analysis of Novel and Nano Building Blocks; Fabrication and Directed and Self Assembly Tools and Processes at Nanoscale; General; Issues Related to Integration Across Scale Boundaries; Modeling and Experimental Validation.