Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials / Edition 1

Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials / Edition 1

by John Lau, C.P. Wong, Ning-Cheng Lee, Ricky Lee
     
 

ISBN-10: 0071386246

ISBN-13: 9780071386241

Pub. Date: 08/23/2002

Publisher: McGraw-Hill Professional Publishing

ELECTRONICS MANUFACTUIRNG WITH LEAD-FREE, HALOGEN-FREE, AND CONDUCTIVE-ADHESTIVE MATERIALS

This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging

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Overview

ELECTRONICS MANUFACTUIRNG WITH LEAD-FREE, HALOGEN-FREE, AND CONDUCTIVE-ADHESTIVE MATERIALS

This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead-free, halogen-free, and conductive-adhesive problem solving methods, and those demanding cost-effective designs and high-yield environmental benign manufacturing processes, this valuable reference covers all aspects of this fast-growing field.

Written for design, materials, process, equipment, manufacturing, reliability, component, packaging, and system engineers, and technical and marketing managers in electronics and photonics packaging and interconnection, this book teaches a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of lead-free, halogen-free, and conductive-adhesive technologies. Among the topics explored:

* Chip (wafer) level interconnects with lead-free solder bumps

* Lead-free solder wafer bumping with micro-ball mounting and paste printing methods

* Lead-free solder joint reliability of WLCSPs on organic and ceramic substrates

* Chip (wafer) level interconnects with solderless bumps such as Ni-Au, Au, and Cu, Cu wires, Au wires, Au studs, and Cu studs

* Design, materials, process, and reliability of WLCSPs with solderless interconnects on PCB/substrate

* Halogen-free molding compounds for PQFP, PBGA, and MAP-PBGA packages

* Environmentally benign die-attach films for PQFP and PBGA packages and lead-free die-attach bonding techniques for IC packaging

* Environmental issues for conventional PCBs and substrates

* Some environmentally conscious flame-retardants for PCBs and organic substrates

* Emerging technologies for fabricating environmental friendly PCBs such as design for environment, green PCB manufacturing, and environmental safety

* Lead-free soldering activities such as legislation, consortia programs, and regional preferences on lead-free solder alternatives

* Criteria, development approaches, and varieties of alloys and properties of lead-free solders

* Physical, mechanical, chemical, electrical, and soldering properties of lead-free solders

* Manufacturing process and performance of lead-free surface finishes for both PCB and component applications

* Implementation and execution challenges of lead-free soldering, especially for the reflow and wave soldering process

* Fundamental understanding of electrically conductive adhesive (ECA) technology

* Effects of lubricant removal and cure shrinkage on ECAs

* Mechanisms underlying the contact resistance shifts of ECAs

* Effects of electrolytes and moisture absorption on contact resistance shifts of ECAs

* Stabilization of contact resistance of ECAs using various additives

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Product Details

ISBN-13:
9780071386241
Publisher:
McGraw-Hill Professional Publishing
Publication date:
08/23/2002
Series:
Professional Engineering Ser.
Pages:
700
Product dimensions:
6.30(w) x 9.20(h) x 1.60(d)

Table of Contents

Ch. 1Introduction to Environmentally Benign Electronics Manufacturing
Ch. 2Chip (Wafer)-Level Interconnects with Lead-Free Solder Bumps
Ch. 3WLCSP with Lead-Free Solder Bumps on PCB/Substrate
Ch. 4Chip (Wafer)-Level Interconnects with Solderless Bumps
Ch. 5WLCSP with Solderless Bumps on PCB/Substrate
Ch. 6Environmentally Benign Molding Compounds for IC Packages
Ch. 7Environmentally Benign Die Attach Films for IC Packaging
Ch. 8Environmental Issues for Conventional PCBs
Ch. 9Halogenated and Halogen-Free Materials for Flame Retardation
Ch. 10Fabrication of Environmentally Friendly PCB
Ch. 11Global Status of Lead-Free Soldering
Ch. 12Development of Lead-Free Solder Alloys
Ch. 13Prevailing Lead-Free Alloys
Ch. 14Lead-Free Surface Finishes
Ch. 15Implementation of Lead-Free Soldering
Ch. 16Challenges for Lead-Free Soldering
Ch. 17Introduction to Conductive Adhesives
Ch. 18Conductivity Establishment of Conductive Adhesives
Ch. 19Mechanisms Underlying the Unstable Contact Resistance of ECAs
Ch. 20Stabilization of Contact Resistance of Conductive Adhesives
Index
About the Author

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