Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials / Edition 1

Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials / Edition 1

by John Lau, C.P. Wong, Ning-Cheng Lee, Ricky Lee
     
 

ISBN-10: 0071386246

ISBN-13: 9780071386241

Pub. Date: 08/23/2002

Publisher: McGraw-Hill Professional Publishing

ELECTRONICS MANUFACTUIRNG WITH LEAD-FREE, HALOGEN-FREE, AND CONDUCTIVE-ADHESTIVE MATERIALS

This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who

Overview

ELECTRONICS MANUFACTUIRNG WITH LEAD-FREE, HALOGEN-FREE, AND CONDUCTIVE-ADHESTIVE MATERIALS

This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead-free, halogen-free, and conductive-adhesive problem solving methods, and those demanding cost-effective designs and high-yield environmental benign manufacturing processes, this valuable reference covers all aspects of this fast-growing field.

Written for design, materials, process, equipment, manufacturing, reliability, component, packaging, and system engineers, and technical and marketing managers in electronics and photonics packaging and interconnection, this book teaches a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of lead-free, halogen-free, and conductive-adhesive technologies. Among the topics explored:

* Chip (wafer) level interconnects with lead-free solder bumps

* Lead-free solder wafer bumping with micro-ball mounting and paste printing methods

* Lead-free solder joint reliability of WLCSPs on organic and ceramic substrates

* Chip (wafer) level interconnects with solderless bumps such as Ni-Au, Au, and Cu, Cu wires, Au wires, Au studs, and Cu studs

* Design, materials, process, and reliability of WLCSPs with solderless interconnects on PCB/substrate

* Halogen-free molding compounds for PQFP, PBGA, and MAP-PBGA packages

* Environmentally benign die-attach films for PQFP and PBGA packages and lead-free die-attach bonding techniques for IC packaging

* Environmental issues for conventional PCBs and substrates

* Some environmentally conscious flame-retardants for PCBs and organic substrates

* Emerging technologies for fabricating environmental friendly PCBs such as design for environment, green PCB manufacturing, and environmental safety

* Lead-free soldering activities such as legislation, consortia programs, and regional preferences on lead-free solder alternatives

* Criteria, development approaches, and varieties of alloys and properties of lead-free solders

* Physical, mechanical, chemical, electrical, and soldering properties of lead-free solders

* Manufacturing process and performance of lead-free surface finishes for both PCB and component applications

* Implementation and execution challenges of lead-free soldering, especially for the reflow and wave soldering process

* Fundamental understanding of electrically conductive adhesive (ECA) technology

* Effects of lubricant removal and cure shrinkage on ECAs

* Mechanisms underlying the contact resistance shifts of ECAs

* Effects of electrolytes and moisture absorption on contact resistance shifts of ECAs

* Stabilization of contact resistance of ECAs using various additives

Product Details

ISBN-13:
9780071386241
Publisher:
McGraw-Hill Professional Publishing
Publication date:
08/23/2002
Series:
Professional Engineering Ser.
Pages:
700
Product dimensions:
6.30(w) x 9.20(h) x 1.60(d)

Table of Contents

Chapter 1: Introduction to Environmentally Benign Electronics Manufacturing

Chapter 2: Chip (Wafer)-Level Interconnects with Lead-Free Solder Bumps

Chapter 3: WLCSP with Lead-Free Solder Bumps on PCB/Substrate

Chapter 4: Chip (Wafer)-Level Interconnects with Solderless Bumps

Chapter 5: WLCSP with Solderless Bumps on PCB/Substrate

Chapter 6: Environmentally Benign Molding Compounds for IC Packages

Chapter 7: Environmentally Benign Die Attach Films for IC Packaging

Chapter 8: Environmental Issues for Conventional PCBs

Chapter 9: Halogenated and Halogen-Free Materials for Flame Retardation

Chapter 10: Fabrication of Environmentally Friendly PCB

Chapter 11: Global Status of Lead-Free Soldering

Chapter 12: Development of Lead-Free Solder Alloys

Chapter 13: Prevailing Lead-Free Alloys

Chapter 14: Lead-Free Surface Finishes

Chapter 15: Implementation of Lead-Free Soldering

Chapter 16: Challenges for Lead-Free Soldering

Chapter 17: Introduction to Conductive Adhesives

Chapter 18: Conductivity Establishment of Conductive Adhesives

Chapter 19: Mechanisms Underlying the Unstable Contact Resistance of ECAs

Chapter 20: Stabilization of Contact Resistance of Conductive Adhesives
Index
About the Author

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