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Electronics Packaging Forum: Multichip Module Technology Issues

Electronics Packaging Forum: Multichip Module Technology Issues

by James E. Morris (Editor), Thomas J. Watson (Editor)

Editorial Reviews

Based on presentations at the Electronics Packaging Symposium, held at the State University of New York, Binghamton in May 1991, this practical volume provides a multidisciplinary treatment of the field of electronic packaging and multichip modules. Among the topics covered: building long-term reliability by increasing polyimide stability; recent discoveries in the field of soldering phenomena relating to fundamental fluid mechanical processes; how to use the finite-difference time-domain approach in electromagnetic modeling; and the development of dedicated test chips for package evaluation in varied field conditions. Annotation c. Book News, Inc., Portland, OR (booknews.com)

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6.34(w) x 9.30(h) x 1.06(d)

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