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Electronics Packaging Forum: Multichip Module Technology Issues
     

Electronics Packaging Forum: Multichip Module Technology Issues

by James E. Morris (Editor), Thomas J. Watson (Editor)
 

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Booknews
Based on presentations at the Electronics Packaging Symposium, held at the State University of New York, Binghamton in May 1991, this practical volume provides a multidisciplinary treatment of the field of electronic packaging and multichip modules. Among the topics covered: building long-term reliability by increasing polyimide stability; recent discoveries in the field of soldering phenomena relating to fundamental fluid mechanical processes; how to use the finite-difference time-domain approach in electromagnetic modeling; and the development of dedicated test chips for package evaluation in varied field conditions. Annotation c. Book News, Inc., Portland, OR (booknews.com)

Product Details

ISBN-13:
9780780304390
Publisher:
IEEE
Publication date:
12/28/1993
Pages:
400
Product dimensions:
6.34(w) x 9.30(h) x 1.06(d)

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