ESD: Failure Mechanisms and Models / Edition 1

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Electrostatic discharge (ESD) failure mechanisms continue to impact semiconductor components and systems as technologies scale from micro- to nano-electronics. This book studies electrical overstress, ESD, and latchup from a failure analysis and case-study approach. It provides a clear insight into the physics of failure from a generalist perspective, followed by investigation of failure mechanisms in specific technologies, circuits and systems. The book is unique in covering both the failure mechanism and the practical solutions to fix the problem from either a technology or circuit methodology.

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Product Details

  • ISBN-13: 9780470511374
  • Publisher: Wiley
  • Publication date: 9/15/2009
  • Edition number: 1
  • Pages: 408
  • Sales rank: 1,109,505
  • Product dimensions: 6.80 (w) x 9.80 (h) x 1.10 (d)

Table of Contents

1 Failure Analysis and ESD 1

2 Failure Analysis Tools, Models, and Physics of Failure 31

3 CMOS Failure Mechanisms 77

4 CMOS Circuits: Receivers and Off-Chip Drivers 125

5 CMOS Integration 159

6 SOI ESD Failure Mechanisms 195

7 RF CMOS and ESD 225

8 Micro-electromechanical Systems 259

9 Gallium Arsenide 287

10 Smart Power, LDMOS, and BCD Technology 315

11 Magnetic Recording 333

12 Photo-masks and Reticles: Failure Mechanisms 361

Index 379

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  • Posted February 15, 2011

    Highly recommended - must-read for ESD designers

    I'm an ESD engineer in the semiconductor industry. I have read many of the ESD books published in the past 20 years, but did not find one dedicated to this topic until this book was published. This is a very important topic for ESD and reliability engineering. So I'm sure that there are many engineers like me who have been waiting for such a book for a long time. This book is very well written like all the other books in this series by Dr. Voldman, who is an IEEE fellow and top expert in the world. The book starts from basic knowledge and then gradually goes into great details. The subject is covered thoroughly and comprehensively. Moreover, there are several reasons that make this book particularly valuable to a wide range of readers from new engineers/students to industry veterans. The best way to learn about failure mechanism is not only by reading the theories, but also studying the pictures from real failure analysis experiments. Such experiments are very specialized and costly, therefore illustrations are more difficult to acquire. In this book, however, there are many high-quality pictures taken from advanced microscopes. Instead of reading the descriptions about how IC fails under ESD and what happens afterward, readers can see what the failure sites look like in reality and learn the failure signatures. While this book is about mechanisms and models, there aren't overwhelmingly complicated equations. Some key equations are included only when absolutely needed. For most readers, especially students and enthusiastic novice readers, the last thing they want is to be discouraged by tedious derivations that don't help directly improve their understanding. With the appropriate number of equations and analysis, reading this book has been a pleasant learning experience. The reference sections are quite complete and very up-to-date. In addition to the carefully chosen classic references, there are many recent references including even papers published in 2008 and 2009, which indicates that the author has made a great effort to keep the materials updated. Many real-world examples in advanced technology nodes are illustrated. This is a big plus considering the discussed field is rapidly advancing. The second half of this book covers many advanced topics in great detail, which is hard to find elsewhere. For example, SOI failures, MEMS, GaAs, Smart Power, Magnetic recording and so on. While some of these topics can be found in conference proceedings, the methodical treatment in this book makes the learning most efficient. I'm glad to have found this book as I realize how critical it is to understand failures mechanisms. Considering the uniqueness of the book's coverage, I believe it is a must-read for ESD and reliability engineers.

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  • Posted May 10, 2010

    A good book about ESD failure mechanisms

    I got this book recently. A very useful book which addresses ESD failure mechanisms comprehensively and systematically. It discusses ESD failure mechanisms in "old" technologies as well as updating the modifications to the state-of-the-art technologies, covering a wide spectrum of technologies from CMOS, RF CMOS, SOI, smart power, GaAs, magneto-resistive heads, tunneling magneto-resistive heads, MEM systems, to photo-masks and reticles. This book starts with the fundamentals and concepts of ESD failure and basics of failure analysis tools, then proceeds to the failure mechanisms of all kinds of FEOL components and BEOL interconnects along with the CMOS technology scaling from 2.0 um to 32 nm, which provides a whole view of the evolvement of ESD failure mechanisms. Further, the book discusses the failure mechanisms associated with CMOS peripheral circuits and chip architecture and design synthesis, focusing on how to build more ESD and EOS robust components and systems, which is what I like most of this book. For example, the author analyses the current paths and failure mechanisms of all the different receiver networks. The understanding can be transferred to other circuits and peripheral devices.

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  • Posted January 30, 2010

    Essential tool/reference for the working Failure Analysis professional.

    The text is effective in relating the physical damage that is observed to the electrical mechanisms that arise during an ESD event. Once the mechanisms are understood changes in the technology and/or the surrounding circuitry can be made that will improve the product and make it more robust to similar overstress exposures.

    The unique perspective that this book offers is that the it provides an explanation more from a failure analyst perspective lessening the focus from a semiconductor physics standpoint. This work provides insights into the types of analysis that can be performed and relating those finding to actual case studies across a wide variety of technologies.

    In summary, as a failure analysis professional this book will be referenced as routinely as an interpretative aid in my day to day analysis work. Highly recommended.

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