Failure Analysis of Integrated Circuits: Tools and Techniques / Edition 1

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Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniq ues in silicon-based semiconductors are applied to understanding the r oot cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsul ation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, a nd it provides a general understanding for making intelligent tool cho ices. Also included is coverage of the shortcomings, limitations, and strengths of each technique.

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Table of Contents

Preface. 1. Introduction; L.C. Wagner. 2. Electrical Characterization; S. Frank, et al. 3. Package Analysis: SAM and X-Ray; T.M. Moore, C. Hartfield. 4. Die Exposure; P.D. Ngo. 5. Global Failure Site Isolation: Thermal Techniques; D.L. Barton. 6. Failure Site Isolation: Photon Emission Microscopy Optical/Electron Beam Techniques; E.I. Cole, D.L. Barton. 7. Probing Technology for IC Diagnosis; C.G. Talbot. 8. Deprocessing; D. Yim. 9. Cross-Section Analysis; T. Haddock, S. Boddicker. 10. Inspection Techniques; L.C. Wagner. 11. Chemical Analysis; L.C. Wagner. 12. Energy Dispersive Spectroscopy; P.D. Ngo. 13. Auger Electron Spectroscopy; R.K. Lowry. 14. Secondary Ion Mass Spectrometry, SIMS; K. Evans. 15. Failure Analysis Future Requirements; D.P. Vallett. Index.

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