Fundamentals of Electrochemical Deposition / Edition 1

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Good Ex-University Library with stickers/stamps. Hardcover. No dustjacket. Text is clean. ISBN 0471168203.

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Overview

This book offers a wide-ranging, authoritative look at state-of-the-art electrochemical deposition theory and practice. Written by an author team with extensive experience in both industry and academe, it provides a well-rounded introduction to the field for students, as well as a means for professional chemists, engineers, and technicians to expand and sharpen their skills in using the technology. Over the course of 18 independent chapters, Drs. Paunovic and Schlesinger present detailed coverage of the full range of electrochemical deposition processes and technologies.
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Editorial Reviews

Booknews
An introduction for readers who are new to the field, only fortuitously appearing at the moment the microelectronics industry is shifting from aluminum connections, which are formed by evaporation, to copper, which are electrodeposited. Among other topics, discusses water and ionic solutions, nucleation and growth models, the effect of additives, and mathematical modeling. Suitable as a text for advanced science and engineering students. References are specific to sub- chapter sections. Annotation c. by Book News, Inc., Portland, Or.
From the Publisher
"…an excellent book for explaining electrochemical deposition to students, practicing engineers, or scientists…" (Journal of Metals Online, July 25, 2007)

"…a great book for anyone who wants to learn about the fundamentals of electrochemical deposition." (IEEE Electrical Insulation Magazine, July/August 2007)

"The book is a definitive treatment of the subject by two experts in the field…" (CHOICE, February 2007)

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Product Details

  • ISBN-13: 9780471168201
  • Publisher: Wiley, John & Sons, Incorporated
  • Publication date: 10/28/1998
  • Series: ECS Series of Texts and Monographs Series , #37
  • Edition number: 1
  • Pages: 312
  • Product dimensions: 6.32 (w) x 9.50 (h) x 0.80 (d)

Meet the Author

MILAN PAUNOVIC, PhD, was, until recently, a research staff member in the Electrodeposition Technology Department at the IBM T. J. Watson Research Center. He began work on electrochemical metal deposition in 1961 at the University of Pennsylvania, Philadelphia, and subsequently worked on metal deposition at Reynolds Metals, Kollmorgen, and Intel. He is a coauthor of the first edition of Fundamentals of Electrochemical Deposition and Modern Electroplating (both by Wiley), has edited four symposia proceedings volumes of The Electrochemical Society, published forty-one papers, and holds seven patents.

MORDECHAY SCHLESINGER, PhD, is a professor in the Department of Physics at the University of Windsor, Ontario, Canada. He is a former associate editor of both the Journal of The Electrochemical Society and Electrochemical and Solid State Letters. He is a fellow of the American Physical Society and The Electrochemical Society. He has also been named a General Motors Academic Research Fellow. He is a coauthor of the first edition of Fundamentals of Electrochemical Deposition and of Modern Electroplating. He has published over 120 research papers and holds four patents.

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Table of Contents

1 Overview 1
2 Water and ionic solutions 7
3 Metals and metal surfaces 25
4 Metal-solution interphase 41
5 Equilibrium electrode potential 55
6 Kinetics and mechanism of electrodeposition 77
7 Nucleation and growth models 113
8 Electroless deposition 139
9 Displacement deposition 169
10 Effect of additives 177
11 Electrodeposition of alloys 199
12 Metal deposit and current distribution 209
13 Characterization of metallic surfaces and thin films 221
14 In situ characterization of deposition 237
15 Mathematical modeling in electrochemistry 249
16 Structure and properties of deposits 273
17 Electrodeposited multilayers 289
18 Interdiffusion in thin films 307
19 Applications in semiconductor technology 321
20 Applications in the fields of magnetism and microelectronics 333
21 Frontiers in applications : the field of medicine 345
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