Fundamentals of Semiconductor Fabrication / Edition 1

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Offers a basic, up-to-date introduction to semiconductor fabrication technology, including both the theoretical and practical aspects of all major steps in the fabrication sequence
Presents comprehensive coverage of process sequences
Introduces readers to modern simulation tools
Addresses the practical aspects of integrated circuit fabrication
Clearly explains basic processing theory

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Editorial Reviews

From Barnes & Noble
The Barnes & Noble Review
Whether you are in the business of manufacturing semiconductors, are planning to be in the business, or are a user of the technology, you will want to know the intimate details of the process. This book covers everything you need to know and more.

Right up front, the authors provide an introduction to semiconductor fabrication technology, from crystal growth to integrated devices and circuits. For example, in Chapter 1, they reveal that many of the semiconductor technologies have been around for a very long time -- some, in fact, for centuries. Chapter 2 deals with crystal growth techniques. Next, Chapter 3 presents silicon oxidation. Photolithography and etching are discussed in Chapters 4 and 5, respectively.

Chapters 6 and 7 present the primary techniques for the introduction of dopants: diffusion and ion implantation. Next, Chapter 8 covers various methods of thin film deposition. Chapter 9 ties the individual process steps together by presenting the process flows for critical process technologies, integrated devices, and microelectrical mechanical systems (MEMS). Chapter 10 introduces high-level integrated circuit manufacturing issues, including electrical testing, packaging, process control, and yield. Chapter 11 discusses the future outlook and challenges for the semiconductor industry.

This book is an outstanding text for class work, presenting an excellent foundation from which the student can draw. And it includes problem sets at the end of each chapter that force the reader into accountability for the material presented. It's also an interesting read for anyone with a scientific outlook and an inquiring mind. John Vacca

John Vacca, the former computer security official (CSO) for NASA's space station program (Freedom), has written 38 books about advanced storage, computer security, and aerospace technology.

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Product Details

  • ISBN-13: 9780471232797
  • Publisher: Wiley
  • Publication date: 4/11/2003
  • Edition description: New Edition
  • Edition number: 1
  • Pages: 320
  • Product dimensions: 7.00 (w) x 10.00 (h) x 0.67 (d)

Meet the Author

Gary S. May, Ph.D. is Executive Assistant to the President andMotorola Foundation Professor of Microelectronics in the School ofElectrical and Computer Engineering at the Georgia Institute ofTechnology. Dr. May was a national Science Foundation nationalYoung Investigator, Georgia Tech's Outstanding Young Alumnus,received Georgia Tech's Outstanding Service Award, and was named aGiant of Science by the Quality Education for Minorities network in2001. He was a member of the NSF Engineering Advisory Committee,served on and chaired the NSF Committee for Equal Opportunity inScience and Engineering, and was Editor-in-Chief for IEEETransactions of Semiconductor Manufacturing from 1997 to 2001.Dr. May currently serves as chair of the National Advisory Boardfor the National Society of Black Engineers.

Simon M. Sze, Ph.D. is UMC Chair Professor of NationalChiao Tung University, and President of the National Nano DeviceLaboratories. He has received the IEEE Ebers Award, the Sun Yet-senAward, the National Science and Technology Award, and the NationalChair Professor Award. He is a Life Fellow of IEEE, a member of theAcademia Sinica, the Chinese Academy of Engineering, and the USNational Academy of Engineering. He has authored or coauthored over150 technical papers, and has written, edited, and contributed to24 books. His book Physics of Semiconductor Devices (Wiley1969, 2nd Ed, 1981) is the most cited work incontemporary engineering and applied science publications (over12,000 citations from ISI Press).

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Table of Contents

Chapter 1. Introduction.

Chapter 2. Crystal Growth.

Chapter 3. Silicon Oxidation.

Chapter 4. Photolithography.

Chapter 5. Etching.

Chapter 6. Diffusion.

Chapter 7. Ion Implantation.

Chapter 8. Film Deposition.

Chapter 9. Process Integration.

Chapter 10. IC Manufacturing.

Chapter 11. Future Trends and Challenges.

Appendix A: List of Symbols.

Appendix B: International System of Units (SI Units).

Appendix C: Unit Prefixes.

Appendix D: Greek Alphabet.

Appendix E: Physical Constants.

Appendix F: Properties of Si and GaAs at 300 K.

Appendix G: Some Properties of the Error Function.

Appendix H: Basic Kinetic Theory of Gases.

Appendix I: SUPREM Commands.

Appendix J: Running PROLITH.

Appendix K. Percentage Points of the t Distribution.

Appendix L: Percentage Points of the F Distribution.


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