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Handbook of Fine Pitch Surface Mount Technology (FPT) is a one-stop guide to the state of the art of FPT. For professionals active in FPT research and development, those who wish to master FPT problem-solving methods, and those who must choose a high-yield and cost-effective manufacturing process for their interconnect systems, here is a timely summary of progress in all aspects of this fascinating field.
| Preface | ||
| Acknowledgments | ||
| 1 | A Brief Introduction to Fine Pitch Surface Mount Technology | |
| 2 | Fine Pitch Packaging for Surface Mount | |
| 3 | Solderability of Fine Pitch Surface Mount Components | |
| 4 | Substrate Materials and Design for Fine Pitch Technology | |
| 5 | Fine Pitch Soldering and Solder Paste | |
| 6 | Screen and Stencil Printing Technology for Fine-Pitch Assembly | |
| 7 | Pick and Place Technology for Fine Pitch Assembly | |
| 8 | Estimation of Solder Volume | |
| 9 | Vapor Phase Solder Reflow for Fine Pitch Assembly | |
| 10 | Convection/Infrared and Convection Dominant Reflow Soldering of Fine Pitch SMT Devices | |
| 11 | Forced Convective Solder Reflow for Fine Pitch Assembly | |
| 12 | Nitrogen-Based Solder Reflow for Fine Pitch Assembly | |
| 13 | Pulsed Thermode Hotbar Bonding | |
| 14 | Aqueous and Semiaqueous Cleaning of Fine Pitch Assemblies | |
| 15 | NonCFC Cleaning (No-Clean) of Fine Pitch Assemblies | |
| 16 | Inspection of Fine Pitch Assemblies | |
| 17 | Surface Mount Repair | |
| 18 | Total Quality Management (TQM) and Statistical Process Control (SPC) for Fine Pitch Assembly | |
| 19 | Thermal Management of Fine Pitch Assemblies | |
| 20 | Electrical Testing of Bare Fine Pitch Printed Circuit Boards | |
| 21 | Reliability Aspects of Fine Pitch Assembly | |
| 22 | Technical Management Issues of Fine Pitch Technology | |
| Authors' Biographies | ||
| Index |
Overview
Handbook of Fine Pitch Surface Mount Technology (FPT) is a one-stop guide to the state of the art of FPT. For professionals active in FPT research and development, those who wish to master FPT problem-solving methods, and those who must choose a high-yield and cost-effective manufacturing process for their interconnect systems, here is a timely summary of progress in all aspects of this fascinating field.