Handbook of Lapping and Polishing

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More About This Textbook

Overview

Provides the first treatment in English dedicated to lapping and polishing technologies and processes Examines lapping of brittle and ductile materials and includes a special chapter on lapping equipment Covers polishing and CMP in detail Presents the latest technologies illustrated by case studies Reflects the experience of leading experts from Japan, Germany, and the US Lapping and polishing are the most precise processes used to finish the surfaces of mechanical and electronics/semiconductor components. The Handbook of Lapping and Polishing is the first book written in English to thoroughly cover these processes. It begins with an introduction focused on the fundamental concepts and the basics of lapping and polishing processes. The book builds on this foundation to discuss lapping of ductile and brittle materials, with a special chapter devoted to lapping equipment. Sections on polishing and chemical-mechanical planarization (CMP) round out the discussion. Experts from the US, Germany, and Japan present the latest technologies for lapping and polishing along with case studies.

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Product Details

Table of Contents

INTRODUCTION; Ioan Marinescu
From Craft to Science
Importance of the Abrasive
Problem Solving
References

FUNDAMENTALS OF LAPPING; Eckart Uhlmann
General Considerations
Historical Development of Lapping
Definition of Lapping and Classification of Lapping Processes
Process Mechanisms and Subsurface Damage in Lapping
Lapping Process as a Removal System
Tool Specification
Machine Settings
Fundamentals of Planetary Kinematics
Process Models and Simulation
Symbols and Abbreviations
References

LAPPING OF DUCTILE MATERIALS; Ioan Marinescu, Ion Benea, and Naga Jyothi Sanku
Introduction
Physics of the Process
Mechanism of the Process
References
Bibliography

LAPPING OF BRITTLE MATERIALS; Ioan Marinescu, Ion Benea, and Mariana Pruteanu
Introduction
Background Information
Nontraditional Lapping Processes
ELID-Lap Grinding
Materials, Experimental Setup, and Testing Procedure (Study Case)
Experimental Results and Discussion
References
Bibliography
Appendix A
Appendix B

LAPPING AND LAPPING MACHINES; Toshiro K. Doi and Daizo Ichikawa
Introduction
Processing Principles of Lapping and Its Characteristics
Lapping Machine
Both-Sides Simultaneous Lapping Machine Equipped with a New Micromotion Mechanism
Conclusions

POLISHING TECHNOLOGY; Toshiro K. Doi
Polishing Principles
Processing Accuracy and Damaged Layer
Polishing Machines
Mechanochemical Polishing and Chemical Mechanical Polishing
Noncontact Polishing
Magnetoabrasive Finishing
Polishing Process Applying Electrophoretic Deposition
Electroabrasive Mirror Polishing Process
P-MAC Polishing
Colloidal Silica Polishing
References

CHEMICAL MECHANICAL POLISHING AND ITS APPLICATIONS IN ULSI PROCESS; Toshiro K. Doi
Orientations and Role of CMP in Semiconductor Process
Basic Concept of Planarization CMP
Basic Technology of Planarization CMP
The Study Case of Device Wafer
Thin Film Magnetic Recording Heads
CMP of Compound Semiconductor Wafers
References
INDEX

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