Handbook of Lapping and Polishing

Hardcover (Print)
Used and New from Other Sellers
Used and New from Other Sellers
from $169.12
Usually ships in 1-2 business days
(Save 19%)
Other sellers (Hardcover)
  • All (4) from $169.12   
  • New (2) from $169.12   
  • Used (2) from $208.94   

More About This Textbook


Provides the first treatment in English dedicated to lapping and polishing technologies and processes Examines lapping of brittle and ductile materials and includes a special chapter on lapping equipment Covers polishing and CMP in detail Presents the latest technologies illustrated by case studies Reflects the experience of leading experts from Japan, Germany, and the US Lapping and polishing are the most precise processes used to finish the surfaces of mechanical and electronics/semiconductor components. The Handbook of Lapping and Polishing is the first book written in English to thoroughly cover these processes. It begins with an introduction focused on the fundamental concepts and the basics of lapping and polishing processes. The book builds on this foundation to discuss lapping of ductile and brittle materials, with a special chapter devoted to lapping equipment. Sections on polishing and chemical-mechanical planarization (CMP) round out the discussion. Experts from the US, Germany, and Japan present the latest technologies for lapping and polishing along with case studies.

Read More Show Less

Product Details

Table of Contents

INTRODUCTION; Ioan Marinescu
From Craft to Science
Importance of the Abrasive
Problem Solving

General Considerations
Historical Development of Lapping
Definition of Lapping and Classification of Lapping Processes
Process Mechanisms and Subsurface Damage in Lapping
Lapping Process as a Removal System
Tool Specification
Machine Settings
Fundamentals of Planetary Kinematics
Process Models and Simulation
Symbols and Abbreviations

LAPPING OF DUCTILE MATERIALS; Ioan Marinescu, Ion Benea, and Naga Jyothi Sanku
Physics of the Process
Mechanism of the Process

LAPPING OF BRITTLE MATERIALS; Ioan Marinescu, Ion Benea, and Mariana Pruteanu
Background Information
Nontraditional Lapping Processes
ELID-Lap Grinding
Materials, Experimental Setup, and Testing Procedure (Study Case)
Experimental Results and Discussion
Appendix A
Appendix B

LAPPING AND LAPPING MACHINES; Toshiro K. Doi and Daizo Ichikawa
Processing Principles of Lapping and Its Characteristics
Lapping Machine
Both-Sides Simultaneous Lapping Machine Equipped with a New Micromotion Mechanism

Polishing Principles
Processing Accuracy and Damaged Layer
Polishing Machines
Mechanochemical Polishing and Chemical Mechanical Polishing
Noncontact Polishing
Magnetoabrasive Finishing
Polishing Process Applying Electrophoretic Deposition
Electroabrasive Mirror Polishing Process
P-MAC Polishing
Colloidal Silica Polishing

Orientations and Role of CMP in Semiconductor Process
Basic Concept of Planarization CMP
Basic Technology of Planarization CMP
The Study Case of Device Wafer
Thin Film Magnetic Recording Heads
CMP of Compound Semiconductor Wafers

Read More Show Less

Customer Reviews

Be the first to write a review
( 0 )
Rating Distribution

5 Star


4 Star


3 Star


2 Star


1 Star


Your Rating:

Your Name: Create a Pen Name or

Barnes & Noble.com Review Rules

Our reader reviews allow you to share your comments on titles you liked, or didn't, with others. By submitting an online review, you are representing to Barnes & Noble.com that all information contained in your review is original and accurate in all respects, and that the submission of such content by you and the posting of such content by Barnes & Noble.com does not and will not violate the rights of any third party. Please follow the rules below to help ensure that your review can be posted.

Reviews by Our Customers Under the Age of 13

We highly value and respect everyone's opinion concerning the titles we offer. However, we cannot allow persons under the age of 13 to have accounts at BN.com or to post customer reviews. Please see our Terms of Use for more details.

What to exclude from your review:

Please do not write about reviews, commentary, or information posted on the product page. If you see any errors in the information on the product page, please send us an email.

Reviews should not contain any of the following:

  • - HTML tags, profanity, obscenities, vulgarities, or comments that defame anyone
  • - Time-sensitive information such as tour dates, signings, lectures, etc.
  • - Single-word reviews. Other people will read your review to discover why you liked or didn't like the title. Be descriptive.
  • - Comments focusing on the author or that may ruin the ending for others
  • - Phone numbers, addresses, URLs
  • - Pricing and availability information or alternative ordering information
  • - Advertisements or commercial solicitation


  • - By submitting a review, you grant to Barnes & Noble.com and its sublicensees the royalty-free, perpetual, irrevocable right and license to use the review in accordance with the Barnes & Noble.com Terms of Use.
  • - Barnes & Noble.com reserves the right not to post any review -- particularly those that do not follow the terms and conditions of these Rules. Barnes & Noble.com also reserves the right to remove any review at any time without notice.
  • - See Terms of Use for other conditions and disclaimers.
Search for Products You'd Like to Recommend

Recommend other products that relate to your review. Just search for them below and share!

Create a Pen Name

Your Pen Name is your unique identity on BN.com. It will appear on the reviews you write and other website activities. Your Pen Name cannot be edited, changed or deleted once submitted.

Your Pen Name can be any combination of alphanumeric characters (plus - and _), and must be at least two characters long.

Continue Anonymously

    If you find inappropriate content, please report it to Barnes & Noble
    Why is this product inappropriate?
    Comments (optional)