Handbook of Silicon Based MEMS Materials and Technologies

by Markku Tilli (Editor), Mervi Paulasto-Kröckel (Editor), Teruaki Motooka (Editor), Veikko Lindroos (Editor), Veli-Matti Airaksinen (Editor)

Overview

A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications.

Key topics covered include:

• Silicon as MEMS material
• Material properties and measurement techniques
• Analytical methods used in materials characterization
• Modeling in MEMS
• Measuring MEMS
• Micromachining technologies in MEMS
• Encapsulation of MEMS components
• Emerging process technologies, including ALD and porous silicon

Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities.

• Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland.
• Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland.
• Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland.
• Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan.

• Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques
• Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs
• Discusses properties, preparation, and growth of silicon crystals and wafers
• Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures

Product Details

ISBN-13:	9780815519881
Publisher:	William Andrew
Publication date:	12/08/2009
Series:	Micro and Nano Technologies
Sold by:	Barnes & Noble
Format:	eBook
Pages:	668
File size:	20 MB
Note:	This product may take a few minutes to download.

About the Author

Markku Tilli obtained a degree in Materials Science (Physical Metallurgy) at Helsinki University of Technology (HUT) in 1974. Until 1980 he had various research and teaching positions at HUT specializing in crystal growth technologies. From 1981 to 1984 he managed process research and development in Silicon project at HUT silicon wafer manufacturing pilot plant. Since 1985 he has had various managing positions at Okmetic in research, development and customer support areas, and held a position of Senior Vice President, Research until his retirement in 2018. His MEMS related activities started in 1982 when he developed a process to make double side polished silicon wafers for bulk micromachined sensors. Since then he has developed advanced new silicon wafer types for MEMS, including special epitaxial wafers, SOI and SOI wafers with buried cavities. His publication topics include oxygen precipitation in silicon, silicon crystal growth, wafer cleaning as well as silicon wafer manufacturing technologies and applications in MEMS. He is member of the Technology Academy of Finland and has received the honorary degree of Doctor of Science in Engineering from Aalto University.
Dr. Mervi Paulasto-Kröckel is professor at Aalto University School of Electrical Engineering in Finland. She studied materials science and semiconductor technology in Helsinki University of Technology, and gradudated as MSc Tech in 1990. She continued her studies in the Technical Universities of Aachen (RWTH Aachen) and Helsinki and attained her doctoral degree in 1995. After a 2-years post-doctoral appointment at the Joint Research Centre of European Commission in the Netherlands, her professional career continued in the electronics industry. She was a Staff Principal Engineer at Motorola Semiconductor Products Sector in Munich. In 2004 Paulasto-Kröckel joined Infineon Technologies where she was the Director Package Development responsible for semiconductor assembly and interconnect development for automotive products worldwide.
At the end of 2018 Dr. Paulasto-Kröckel became a professor at Helsinki University of Technology, which is now called Aalto University after a merger with two other leading universities in the Helsinki area. Her current research focus is on advanced materials and interconnect technologies for MEMS/NEMS and power electronics, as well as multi-material assemblies behavior under different loads and their characteristic failure mechanisms. Her group has extensive experience in studying interactions and interfacial reactions between dissimilar materials, such as different oxide and nitride materials, metals and semiconductors. The group has developed a combined methodology approach to solve multi-materials compatibility issues in microelectronics and microsystems.
Prof. Paulasto-Kröckel has over 110 international publications in the fields of microelectronics packaging and interfacial compatibility of dissimilar materials. She is IEEE EPS Distinguished Lecturer and a member of the Finnish Academy of Technical Sciences.
Teruaki Motooka received PhD degree in 1981 in Applied Physics from Kyushu University. He was a research scientist in the Central Research Laboratory, Hitachi Ltd. for 1971-1984, a visiting research assistant professor at University of Illinois at Urbana-Champaign, USA for 1984-1988, an associate professor in the Institute of Applied Physics at University of Tsukuba, Japan for 1988-1993, and became a full professor at Kyushu University in 1993. He retired from Kyushu University in 2010.
He has published more than 150 scientific papers on various international journals and these papers have been cited more than 2000 times.
Veikko Lindroos is Professor Emeritus, Physical Metallurgy and Materials Science, Aalto University, Finland. His research covers a broad spectrum of materials science and technology, such as metallic materials, silicon technology and MEMS materials magnetic, electronic and composite materials as well as shape memory effect and materials.

Table of Contents

PART I: Silicon as MEMS Material Edited by Markku Tilli 1. Properties of silicon 2. CZ Growth of silicon crystals 3. Properties of silicon crystals 4. Oxygen in Silicon 5. Silicon wafers; preparation and properties 6. Epi wafers; preparation and properties 7. Thick-Film SOI wafers; preparation and properties 8. Silicon dioxides PART II: Modeling in MEMS Edited by Teruaki Motooka and Risto Nieminen 9. Multiscale modeling methods 10. Manufacture and processing of MEMS structures 11. Mechanical properties of silicon microstructures 12. Electrostatic and RF properties of MEMS structures 13. Optical Modelling of MEMS 14. Gas Damping in Vibrating MEMS structures PART III: Measuring MEMS Edited by Veli-Matti Airaksinen 15. Introduction to Measuring MEMS 16. Silicon wafer and thin film measurements 17. Optical measurement of static and dynamic displacement 18. MEMS residual stress characterization, methodology and perspective 19. Strength of bonded interfaces 20. Focused ion and electron beam techniques 21.Oxygen and Bulk Microdefects in Silicon PART IV: Micromachining Technologies in MEMS Edited by Helmut Seidel 22. MEMS litography 23. Deep reactive ion etching (DRIE) 24. Wet etching of silicon 25. Porous silicon based MEMS 26. Atomic layer deposition in MEMS technology 27. Metallic glass 29. Surface micromachining 29. Silicon based bioMEMS micromachining technologies PART V: Encapsulation of MEMS Components Edited by Heikki Kuisma and Ari Lehto 30. Introduction to encapsulation of MEMS devices 31. Silicon direct bonding 32. Anodic bonding 33. Glass frit bonding 34. Metallic alloy seal bonding 35. Bonding CMOS processed wafers 36. Non-Destructive Bond Strength Testing of Anodic Bonded Wafers 37. Wafer Bonding Equipment 38. Encapsulation by Film Deposition 39. Via Technologies for MEMS 40. Outgassing and Gettering 41. Dicing of MEMS devices 42. Hermecity Tests

What People are Saying About This

From the Publisher

The most important book for manufacturing sensors with MEMS technologies

Editorial Reviews

"This is a comprehensive state-of-the-art guide on MEMS materials and manufacturing for current and future applications. Engineers, materials scientists, and MEMS developers will find this handbook to be an invaluable resource that will not sit on a bookshelf but rather be a well-used reference text used in the development of MEMS devices."—Electrical Insulation

"Handbook of Silicon Based MEMS Materials and Technologies was published in April 2010. Altogether 73 leading experts from 12 countries participated to the writing process and the result was nearly 700 pages about materials, modeling, measuring, processes and packaging within silicon based MEMS."—MEMS Blog

From the Publisher