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A description of both the theory and practice of physical measurements that use high-sensitivity moiré - principally moiré interferometry. The focus here is on the mechanics and micromechanics of materials and structural elements and the book includes new studies published for the first time. Diverse fields are addressed: advanced composite materials, thermal stresses, electronic packaging, fracture, metallurgy, time-dependence, strain gage calibration. All the methods can be applied for whole-field measurements on nearly and solid bodies. This reader-friendly book will serve engineers and scientists who are concerned with measurements of real phenomena, while also stimulating students to pursue the treasures of experimental analysis.
| Series Preface | ||
| Preface/Acknowledgments | ||
| List of Symbols | ||
| 1 | Introduction | 1 |
| 2 | Elements of Optics | 9 |
| 3 | Geometric Moire | 85 |
| 4 | Moire Interferometry | 135 |
| 5 | Microscopic Moire Interferometry: Very High Sensitivity | 227 |
| 6 | On the Limits of Moire Interferometry | 257 |
| 7 | Laminated Composites in Compression: Free-edge Effects | 273 |
| 8 | Thermal Stresses Near the Interface of a Bimaterial Joint | 293 |
| 9 | Textile Composites | 313 |
| 10 | Thermal Deformations in Electronic Packaging | 331 |
| 11 | Advanced Composites Studies | 349 |
| 12 | Metallurgy, Fracture, Dynamic Loading | 369 |
| 13 | Strain Standard for Calibration of Electrical Strain Gages | 391 |
| Appendices | 419 | |
| A Shadow Moire with Enhanced Sensitivity | 419 | |
| B Submaster Grating Molds | 431 | |
| C Adhesives for Replication of Specimen Gratings | 437 | |
| Subject Index | 439 |
Overview
A description of both the theory and practice of physical measurements that use high-sensitivity moiré - principally moiré interferometry. The focus here is on the mechanics and micromechanics of materials and structural elements and the book includes new studies published for the first time. Diverse fields are addressed: advanced composite materials, thermal stresses, electronic packaging, fracture, metallurgy, time-dependence, strain gage calibration. All the methods can be applied for whole-field measurements ...