Low Cost Flip Chip Technologies: Direct Chip Attach

Low Cost Flip Chip Technologies: Direct Chip Attach

by John H. Lau
     
 

One-stop, cutting-edge guide to flip chip technologies. Now you can turn to a single, all-encompassing reference for a practical understanding of the fast-developing field that's taking the electronics industry by storm. Low-Cost Flip Chip Technologies, by John H. Lau, brings you up to speed on the economic, design, materials, process,equipment, quality, manufacturing…  See more details below

Overview

One-stop, cutting-edge guide to flip chip technologies. Now you can turn to a single, all-encompassing reference for a practical understanding of the fast-developing field that's taking the electronics industry by storm. Low-Cost Flip Chip Technologies, by John H. Lau, brings you up to speed on the economic, design, materials, process,equipment, quality, manufacturing, and reliability issues related to low cost flip chip technologies. This eye-opening overview tells you what you need to know about applying flip chip technologies to direct chip attach(DCA), flip chip on board (FCOB), wafer level chip scale package (WLCSP), and plastic ball grid array (PBGA) package assemblies. You'll discover flip chip problem-solving methods, and learn how to choose a cost-effective design and reliable, high-yield manufacturing process for your interconnect systems as you explore...

*IC trends and packaging technology updates
*Over 12 different wafer-bumping methods...more than 100 lead-free solder alloys
*Sequential build up PCB with microvias and via-in-pad
*How to select underfill materials
*And much, much more!

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Editorial Reviews

Booknews
Lau synthesizes the developments to date of solder-bumped flip chips on low-cost organic substrates as a higher-density, higher-performance and lower-cost alternative to ceramic substrates. He describes their use in direct chip attach, flip chip on board, wafer level chip scale package, and plastic ball grid array package assemblies. There are still many economic, design, materials, process, equipment, quality, manufacturing, and reliability issues, he warns. The information would interest engineers and technicians working in product design and other jobs in the electronics industry. Annotation c. Book News, Inc., Portland, OR (booknews.com)

Product Details

ISBN-13:
9780071351416
Publisher:
McGraw-Hill Companies, The
Publication date:
02/08/2000
Series:
McGraw-Hill Professional Engineering Series
Pages:
585
Product dimensions:
6.34(w) x 9.34(h) x 1.76(d)

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