Low-Dielectric Constant Materials II: Volume 443

Low-Dielectric Constant Materials II: Volume 443

by Helmuth Treichel, A. C. Jones, A. Lagendijk, K. Uram
     
 

ISBN-10: 1558993479

ISBN-13: 9781558993471

Pub. Date: 10/28/1997

Publisher: Materials Research Society

Low-dielectric constant materials are needed to improve the performance and speed of future integrated circuits. In fact, the diversity of contributors to this book is testimony to the global significance of the topic to the future of semiconductor manufacturing. Presentations include those by semiconductor equipment manufacturers and chemical source suppliers,

Overview

Low-dielectric constant materials are needed to improve the performance and speed of future integrated circuits. In fact, the diversity of contributors to this book is testimony to the global significance of the topic to the future of semiconductor manufacturing. Presentations include those by semiconductor equipment manufacturers and chemical source suppliers, academia from six countries, four government laboratories and five major device manufacturers. Approaches to designing and implementing reduction in dielectric constant for intermetal dielectric materials are featured and range from the evolution of silicon dioxide to fluorinated silicate glass, to the use of inorganic/organic polymers and spin-on-material, to fluorinated diamond-like carbon and nanoporous silica. The book also addresses the practical aspects of the use of low-dielectric constant materials such as chemical mechanical polishing of these materials and optimization of wiring delays in devices utilizing low-k material.

Product Details

ISBN-13:
9781558993471
Publisher:
Materials Research Society
Publication date:
10/28/1997
Series:
MRS Proceedings Series
Pages:
203

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