Low-Dielectric Constant Materials II: Volume 443

Hardcover (Print)
Used and New from Other Sellers
Used and New from Other Sellers
from $3.79
Usually ships in 1-2 business days
(Save 90%)
Other sellers (Hardcover)
  • All (5) from $3.79   
  • New (1) from $84.45   
  • Used (4) from $3.79   
Sort by
Page 1 of 1
Showing All
Note: Marketplace items are not eligible for any BN.com coupons and promotions
Seller since 2011

Feedback rating:



New — never opened or used in original packaging.

Like New — packaging may have been opened. A "Like New" item is suitable to give as a gift.

Very Good — may have minor signs of wear on packaging but item works perfectly and has no damage.

Good — item is in good condition but packaging may have signs of shelf wear/aging or torn packaging. All specific defects should be noted in the Comments section associated with each item.

Acceptable — item is in working order but may show signs of wear such as scratches or torn packaging. All specific defects should be noted in the Comments section associated with each item.

Used — An item that has been opened and may show signs of wear. All specific defects should be noted in the Comments section associated with each item.

Refurbished — A used item that has been renewed or updated and verified to be in proper working condition. Not necessarily completed by the original manufacturer.

Brand new and unread! Join our growing list of satisfied customers!

Ships from: Phoenix, MD

Usually ships in 1-2 business days

  • Standard, 48 States
  • Standard (AK, HI)
Page 1 of 1
Showing All
Sort by


Low-dielectric constant materials are needed to improve the performance and speed of future integrated circuits. In fact, the diversity of contributors to this book is testimony to the global significance of the topic to the future of semiconductor manufacturing. Presentations include those by semiconductor equipment manufacturers and chemical source suppliers, academia from six countries, four government laboratories and five major device manufacturers. Approaches to designing and implementing reduction in dielectric constant for intermetal dielectric materials are featured and range from the evolution of silicon dioxide to fluorinated silicate glass, to the use of inorganic/organic polymers and spin-on-material, to fluorinated diamond-like carbon and nanoporous silica. The book also addresses the practical aspects of the use of low-dielectric constant materials such as chemical mechanical polishing of these materials and optimization of wiring delays in devices utilizing low-k material.

Read More Show Less

Editorial Reviews

Reflecting the global significance of the topic to the future of the semiconductor industry, workshop presentations (26 of the 35 are contained here) were given by manufacturers and chemical suppliers, as well as academics from several countries and government laboratories. Diversity is also reflected in the state-of-the-art approaches currently under investigation for the design, implementation, and optimization of low-k dielectric devices: e.g. the evolution of silicon dioxide to fluorinated silicate glass, the use of polymers, diamond-like carbon, and nanoporous silica. Annotation c. by Book News, Inc., Portland, Or.
Read More Show Less

Product Details

  • ISBN-13: 9781558993471
  • Publisher: Materials Research Society
  • Publication date: 10/28/1997
  • Series: MRS Proceedings Series
  • Pages: 203

Table of Contents

Low-Dielectric Constant Materials for IC Intermetal Dielectric Applications: A Status Report on the Leading Candidates 3
A Study of Anisotropy of Spin Cast and Vapor-Deposited Polyimide Films Using Internal Reflection Techniques 15
Parylene AF-4: A Low [epsilon][subscript R] Material Candidate for ULSI Multilevel Interconnect Applications 21
Interconnect Process Technology Using Perfluorocyclobutane (PFCB) 35
Fluorocarbon Films From Plasma Polymerization of Hexafluoropropylene and Hydrogen 41
Toughened, Inorganic-Organic Hybrid Materials for Microelectronic Application 47
Fluorinated Heteroaromatic Polyethers for Low Dielectric Constant/High Temperature Applications 59
Thermal Curing Conditions for Low-k Fluorinated Polyimide Film for Use as the Interlayer Dielectric in ULSI 71
Mechanical and Dielectric Properties of Low-Permittivity Dielectric Materials 79
Evaluation of PTFE Nanoemulsion as a Low-Dielectric Constant Material ILD 85
Nanoporous Silica for Low-k Dielectrics 91
Deposition and Characterization of Porous Silica Xerogel Films 99
Low-k Mesoporous Silica Films Through Template-Based Processing 105
Chemical Bonding of Fluorine Atoms in SiOF Alloys: Microscopic Mechanisms for Reductions in the Dielectric Constant Relative to SiO[subscript 2] 111
The Thermal Stability of Fluorine-Doped Silicon Oxide Films Formed by ECRCVD With SiF[subscript 4] and O[subscript 2] Gases 119
Characterization of PECVD-Deposited Fluorosilicate Glass (FSG) After CMP and Cleaning 127
PE-CVD of F-Doped SiO[subscript 2] Thin Films Using Tetraisocyanatesilane and Tetrafluorosilane 137
Effect of Fluorine Addition to Plasma-Enhanced Chemical Vapor Deposition Silicon Oxide Film 143
Thermal Stability of Flourinated SiO[subscript 2] Films: Effects of Hydration and Film-Substrate Interaction 149
Diamondlike Carbon Materials as Low-k Dielectrics for Multilevel Interconnects in ULSI 155
Fluorinated Amorphous Carbon Thin Films Grown From C[subscript 4]F[subscript 8] for Multilevel Interconnections of Integrated Circuits 165
Poly(Arylene Ethers) as Low Dielectric Constant Materials for ULSI Interconnect Applications 171
A Comparison of Three Low Dielectric Constant Organic Polymers 177
Optimization of AlCu Wiring Delay in Advanced CMOS Technology 183
Preliminary Electrical Characterization of Pulsed-Plasma-Enhanced Chemical Vapor-Deposited Teflonlike Thin Films 189
Influence of the Cure Process on the Properties of Hydrogen Silsequioxane Spin-on Glass 195
Author Index 201
Subject Index 203
Read More Show Less

Customer Reviews

Be the first to write a review
( 0 )
Rating Distribution

5 Star


4 Star


3 Star


2 Star


1 Star


Your Rating:

Your Name: Create a Pen Name or

Barnes & Noble.com Review Rules

Our reader reviews allow you to share your comments on titles you liked, or didn't, with others. By submitting an online review, you are representing to Barnes & Noble.com that all information contained in your review is original and accurate in all respects, and that the submission of such content by you and the posting of such content by Barnes & Noble.com does not and will not violate the rights of any third party. Please follow the rules below to help ensure that your review can be posted.

Reviews by Our Customers Under the Age of 13

We highly value and respect everyone's opinion concerning the titles we offer. However, we cannot allow persons under the age of 13 to have accounts at BN.com or to post customer reviews. Please see our Terms of Use for more details.

What to exclude from your review:

Please do not write about reviews, commentary, or information posted on the product page. If you see any errors in the information on the product page, please send us an email.

Reviews should not contain any of the following:

  • - HTML tags, profanity, obscenities, vulgarities, or comments that defame anyone
  • - Time-sensitive information such as tour dates, signings, lectures, etc.
  • - Single-word reviews. Other people will read your review to discover why you liked or didn't like the title. Be descriptive.
  • - Comments focusing on the author or that may ruin the ending for others
  • - Phone numbers, addresses, URLs
  • - Pricing and availability information or alternative ordering information
  • - Advertisements or commercial solicitation


  • - By submitting a review, you grant to Barnes & Noble.com and its sublicensees the royalty-free, perpetual, irrevocable right and license to use the review in accordance with the Barnes & Noble.com Terms of Use.
  • - Barnes & Noble.com reserves the right not to post any review -- particularly those that do not follow the terms and conditions of these Rules. Barnes & Noble.com also reserves the right to remove any review at any time without notice.
  • - See Terms of Use for other conditions and disclaimers.
Search for Products You'd Like to Recommend

Recommend other products that relate to your review. Just search for them below and share!

Create a Pen Name

Your Pen Name is your unique identity on BN.com. It will appear on the reviews you write and other website activities. Your Pen Name cannot be edited, changed or deleted once submitted.

Your Pen Name can be any combination of alphanumeric characters (plus - and _), and must be at least two characters long.

Continue Anonymously

    If you find inappropriate content, please report it to Barnes & Noble
    Why is this product inappropriate?
    Comments (optional)