Mechanical Analysis of Electronic Packaging Systems / Edition 1

by Stephen A. McKeown

Overview

"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."

Product Details

ISBN-13:	9780367399818
Publisher:	Taylor & Francis
Publication date:	09/05/2019
Pages:	376
Product dimensions:	6.00(w) x 9.00(h) x (d)

About the Author

Stephen A. McKeown, Lockheed Martin Control Systems, Johnson City, New York.

Table of Contents

Analytical tools; thermal performance analysis; mechanical performance analysis; life analysis; other analysis; analysis of test data; reporting and verification.

Editorial Reviews

...comprehensive.... "...Stephen McKeown has provided a handy reference for the execution of mechanical analyses of electronic systems. In addition to being a very good desk reference for the practicing engineer, the book appears to be an invaluable resource tool for graduate students in aiding them with planning and executing a thesis or dissertation project.

Journal of Electronic Packaging

For practicing, graduate, or advanced undergraduate mechanical, electrical, or quality control engineers, offers an intuitive approach to analyzing and remedying electronic packaging configuration problems. Evaluates packaging stresses and strains in thermal, mechanical, and life environments; reviews recent electronic packing developments such as ball-grid array and multichip modules; explores hand calculations, symbolic equation solvers, spreadsheets, and finite-element analysis; describes technologies such as flow-through modules, heat pipes, thermoelectrics, and immersion/phase change cooling; explains the setup and analysis of tests to measure or verify system performance; and considers other aspects. Annotation c. Book News, Inc., Portland, OR (booknews.com)

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