Placement and Routing of Electronic Modules

by Michael Pecht (Editor)

Overview

This practical guide presents and compares the fundamental theories and techniques of placement and routing and provides important new approaches to solving specific problems.;Focusing on highly reliable methods for good manufacturing capability, Placement and Routing of Electronic Modules: discusses the mathematical basis for placement and routing, including set, combinatorial and graph theories; explicates the definitions, structures and relationships of tree types and gives methods of finding minimum trees; furnishes useful techniques for placing and routing high-density modules; supplies ways to determine the work-space area needed for placement and routing; shows how to estimate the number of layers necessary to complete routing; explains via minimization to reduce work-space area, facilitate manufacture, and reduce the number of layers; demonstrates a variety of search strategies for paths connecting two nodes on a work space with obstacles; and much more. Containing over 300 illustrative examples, figures and tables that clarify concepts and enhance understanding, Placement and Routing of Electronic Modules should be a useful tool for electrical and electronics, mechanical, reliability, process, and manufacturing engineers; computer scientists; applied mathematicians; and graduate-level students in these disciplines.

Product Details

ISBN-13:	9780367402426
Publisher:	Taylor & Francis
Publication date:	09/05/2019
Series:	Electrical and Computer Engineering
Pages:	352
Product dimensions:	6.00(w) x 9.00(h) x (d)

About the Author

Michael Pecht, a Professional Engineer, is Director of the Computer Aided Life Cycle Engineering (CALCE) Electronic Packaging Research Center, University of Maryland at College Park. The author or coauthor of over 200 professional papers and editor of the Handbook of Electronic Package Design (Marcel Dekker, Inc.), he is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE), serves on the board of advisors for the Society of Manufacturing Engineers' Electronics Division, and is a member of the International Electronics Packaging Society, the American Society of Mechanical Engineers, and the Institute for Interconnecting and Packaging Electronic Circuits, among other organizations. He is also the chief editor of the IEEE Transactions on Reliability. Dr. Pecht received the B.S. (1976) degree in acoustics, the M.S. (1978) degree in electrical engineering, and the M.S. (1979) and Ph.D. (1982) degrees in engineering mechanics from the University of Wisconsin - Madison.

Table of Contents

Basic concepts, Guoqing Li et al; characterization and generation of trees, Yuen Tsun Wong et al; signal layer estimation, Sudha Balakrishnan and Michael Pecht; placement for routability, Yuen Tsun Wong et al; placement for reliability and producibility, Michael Osterman and Michael Pecht; detailed routing, Yuen Tsun Wong et al; via minimization, Guoqing Li et al; a solution for Steiner's problem, Yeun Tsun Wong and Michael Pecht. Appendices symbols, acronyms, glossary.

Editorial Reviews

Focusing on highly reliable methods for good manufacturing quality, this practical guide presents and compares the fundamental theories and techniques of placement and routing and provides new approaches to solving specific problems. Eight chapters cover basic concepts, characterization and generation of trees, signal layer estimation, placement for routability, placement for reliability and producibility, detailed routing, via minimization, and a solution for Steiner's problem. Includes a glossary. Annotation c. Book News, Inc., Portland, OR (booknews.com)

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