Principles of Plasma Discharges and Materials Processing / Edition 2

Hardcover (Print)
Used and New from Other Sellers
Used and New from Other Sellers
from $142.52
Usually ships in 1-2 business days
(Save 20%)
Other sellers (Hardcover)
  • All (9) from $142.52   
  • New (8) from $142.52   
  • Used (1) from $190.74   

Overview

A Thorough Update of the Industry Classic on Principles of Plasma Processing

The first edition of Principles of Plasma Discharges and Materials Processing, published over a decade ago, was lauded for its complete treatment of both basic plasma physics and industrial plasma processing, quickly becoming the primary reference for students and professionals.

The Second Edition has been carefully updated and revised to reflect recent developments in the field and to further clarify the presentation of basic principles. Along with in-depth coverage of the fundamentals of plasma physics and chemistry, the authors apply basic theory to plasma discharges, including calculations of plasma parameters and the scaling of plasma parameters with control parameters.

New and expanded topics include:
* Updated cross sections
* Diffusion and diffusion solutions
* Generalized Bohm criteria
* Expanded treatment of dc sheaths
* Langmuir probes in time-varying fields
* Electronegative discharges
* Pulsed power discharges
* Dual frequency discharges
* High-density rf sheaths and ion energy distributions
* Hysteresis and instabilities
* Helicon discharges
* Hollow cathode discharges
* Ionized physical vapor deposition
* Differential substrate charging

With new chapters on dusty plasmas and the kinetic theory of discharges, graduate students and researchers in the field of plasma processing should find this new edition more valuable than ever.

Read More Show Less

Editorial Reviews

Booknews
A text-reference that offers an integrated presentation of the fundamental physics and chemistry of partially ionized, chemically reactive, low-pressure plasmas and their roles in a wide range of plasma discharges and processes used in thin film processing applications, especially in the fabrication of integrated circuits. Includes many fully worked examples, practice exercises, and demonstrations of the relationship of plasma parameters to external control parameters and processing results. Annotation c. Book News, Inc., Portland, OR booknews.com
From the Publisher
"The authors have done an excellent job…this is a good book for an academic course that will provide the foundation to senior-level and graduate students…" (MRS Bulletin, November2005)
Read More Show Less

Product Details

  • ISBN-13: 9780471720010
  • Publisher: Wiley
  • Publication date: 4/8/2005
  • Edition description: REV
  • Edition number: 2
  • Pages: 800
  • Sales rank: 1,300,267
  • Product dimensions: 6.48 (w) x 9.23 (h) x 1.65 (d)

Meet the Author

MICHAEL A. LIEBERMAN, PhD, is Professor in the Graduate School in Electrical Engineering at the University of California, Berkeley. He has published more than 170 journal articles on the topics of plasmas, plasma processing, and nonlinear dynamics. He has also coauthored, with Professor Lichtenberg, Regular and Stochastic Motion and Regular and Chaotic Dynamics, Second Edition.

ALLAN J. LICHTENBERG, PhD, is Professor in the Graduate School in Electrical Engineering at the University of California, Berkeley. A respected pioneer in the fields of high-temperature plasmas, plasma discharges, and nonlinear dynamics, he has published about 150 articles in these areas. In addition to the books coauthored with Professor Lieberman, he has written an earlier monograph Phase-Space Dynamics of Particles (Wiley).

Read More Show Less

Table of Contents

1. Introduction.

2. Basic Plasma Equations and Equilibrium.

3. Atomic Collisions.

4. Plasma Dynamics.

5. Diffusion and Transport.

6. DC Sheaths.

7. Chemical Reactions and Equilibrium.

8. Molecular Collisions.

9. Chemical Kinetics and Surface Processes.

10. Particle and Energy Balance in Discharges.

11. Capacitive Discharges.

12. Inductive Discharges.

13. Wave-Heated Discharges.

14. DC Discharges.

15. Etching.

16. Deposition and Implantation.

17. Dusty Plasmas.

18. Kinetic Theory of Discharges.

Appendix A: Collision Dynamics.

Appendix B: The Collision Integral.

Appendix C: Diffusion Solutions for Variable Mobility Model.

Read More Show Less

Customer Reviews

Be the first to write a review
( 0 )
Rating Distribution

5 Star

(0)

4 Star

(0)

3 Star

(0)

2 Star

(0)

1 Star

(0)

Your Rating:

Your Name: Create a Pen Name or

Barnes & Noble.com Review Rules

Our reader reviews allow you to share your comments on titles you liked, or didn't, with others. By submitting an online review, you are representing to Barnes & Noble.com that all information contained in your review is original and accurate in all respects, and that the submission of such content by you and the posting of such content by Barnes & Noble.com does not and will not violate the rights of any third party. Please follow the rules below to help ensure that your review can be posted.

Reviews by Our Customers Under the Age of 13

We highly value and respect everyone's opinion concerning the titles we offer. However, we cannot allow persons under the age of 13 to have accounts at BN.com or to post customer reviews. Please see our Terms of Use for more details.

What to exclude from your review:

Please do not write about reviews, commentary, or information posted on the product page. If you see any errors in the information on the product page, please send us an email.

Reviews should not contain any of the following:

  • - HTML tags, profanity, obscenities, vulgarities, or comments that defame anyone
  • - Time-sensitive information such as tour dates, signings, lectures, etc.
  • - Single-word reviews. Other people will read your review to discover why you liked or didn't like the title. Be descriptive.
  • - Comments focusing on the author or that may ruin the ending for others
  • - Phone numbers, addresses, URLs
  • - Pricing and availability information or alternative ordering information
  • - Advertisements or commercial solicitation

Reminder:

  • - By submitting a review, you grant to Barnes & Noble.com and its sublicensees the royalty-free, perpetual, irrevocable right and license to use the review in accordance with the Barnes & Noble.com Terms of Use.
  • - Barnes & Noble.com reserves the right not to post any review -- particularly those that do not follow the terms and conditions of these Rules. Barnes & Noble.com also reserves the right to remove any review at any time without notice.
  • - See Terms of Use for other conditions and disclaimers.
Search for Products You'd Like to Recommend

Recommend other products that relate to your review. Just search for them below and share!

Create a Pen Name

Your Pen Name is your unique identity on BN.com. It will appear on the reviews you write and other website activities. Your Pen Name cannot be edited, changed or deleted once submitted.

 
Your Pen Name can be any combination of alphanumeric characters (plus - and _), and must be at least two characters long.

Continue Anonymously
Sort by: Showing 1 Customer Reviews
  • Anonymous

    Posted August 2, 2005

    Must have if you are in the field

    A very clear presentation of the basics of materials processing plasma. Chapter 10 is the single most important thing I've learned about plasma in 9 years of study and work.

    Was this review helpful? Yes  No   Report this review
Sort by: Showing 1 Customer Reviews

If you find inappropriate content, please report it to Barnes & Noble
Why is this product inappropriate?
Comments (optional)