Reliability of RoHS-Compliant 2D and 3D IC Interconnects / Edition 1

Reliability of RoHS-Compliant 2D and 3D IC Interconnects / Edition 1

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by John Lau
     
 

Proven 2D and 3D IC lead-free interconnect reliability techniques

Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability

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Overview

Proven 2D and 3D IC lead-free interconnect reliability techniques

Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.

Covers reliability of:

  • 2D and 3D IC lead-free interconnects
  • CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints
  • Lead-free (SACX) solder joints
  • Low-temperature lead-free (SnBiAg) solder joints
  • Solder joints with voids, high strain rate, and high ramp rate
  • VCSEL and LED lead-free interconnects
  • 3D LED and 3D MEMS with TSVs
  • Chip-to-wafer (C2W) bonding and lead-free interconnects
  • Wafer-to-wafer (W2W) bonding and lead-free interconnects
  • 3D IC chip stacking with low-temperature bonding
  • TSV interposers and lead-free interconnects
  • Electromigration of lead-free microbumps for 3D IC integration

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Product Details

ISBN-13:
9780071753791
Publisher:
McGraw-Hill Professional Publishing
Publication date:
12/01/2010
Pages:
640
Product dimensions:
6.10(w) x 9.10(h) x 1.10(d)

Table of Contents

Ch 1. Introduction to RoHS Compliant Semiconductor and Packaging Technologies;
Ch 2. Reliability Engineering of Lead-Free Interconnects;
Ch 3. Notes on Failure Criterion;
Ch 4. Reliability of 1657-Pin CCGA Lead-Free Solder Joints;
Ch 5. Reliability of PBGA Lead-Free Solder Joints (With and Without Underfills);
Ch 6. Reliability of LED Lead-Free Interconnects;
Ch 7. Reliability of VCSEL Lead-Free Interconnects;
Ch 8. Reliability of Low-Temperature Lead-Free (SnBiAg) Solder Joints;
Ch 9. Reliability of Lead-Free (SACX) Solder Joints;
Ch 10. Chip-to-Wafer (C2W) Bonding and Lead-Free Interconnect Reliability;
Ch 11. Wafer-to-Wafer (W2W) Bonding and Lead-Free Interconnect Reliability;
Ch 12. Through-Silicon-Via (TSV) Interposer Reliability;
Ch 13. Electromigration of Lead-Free Microbumps for 3D IC Integration;
Ch 14. Effects of Dwell-Time and Ramp-Rate on SAC Thermal Cycling Test Results;
Ch 15. Effects of High Strain Rate (Impact) on SAC Solder Balls/Bumps;
Ch 16. Effects of Voids on Solder Joints Reliability;
Index

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