RF and Microwave Microelectronics Packaging / Edition 1

RF and Microwave Microelectronics Packaging / Edition 1

5.0 1
by Ken Kuang
     
 

ISBN-10: 1441909834

ISBN-13: 9781441909831

Pub. Date: 11/17/2009

Publisher: Springer US

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in

Overview

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Product Details

ISBN-13:
9781441909831
Publisher:
Springer US
Publication date:
11/17/2009
Edition description:
2010
Pages:
285
Product dimensions:
1.70(w) x 2.40(h) x 0.70(d)

Table of Contents

Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies.- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages.- Polymeric Microelectromechanical Millimeter Wave Systems.- Millimeter-Wave Chip-on-Board Integration and Packaging.- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules.- RF/Microwave Substrate Packaging Roadmap for Portable Devices.- Ceramic Systems in Package for RF and Microwave.- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications.- LTCC Substrates for RF/MW Application.- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging.- High Performance Microelectronics Packaging Heat Sink Materials.- Technology Research on AlN 3D MCM.

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RF and Microwave Microelectronics Packaging 5 out of 5 based on 0 ratings. 1 reviews.
Anonymous More than 1 year ago
This book summarizes the latest development in RF/MW packaging. This is a very useful reference book for both scientists and engineers working in high frequency packaging. Highly recommended.