Semiconductor Industry: Wafer Fab Exhaust Management

Semiconductor Industry: Wafer Fab Exhaust Management

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by J. Michael Sherer
     
 

Given the myriad exhaust compounds and the corresponding problems that they can pose in an exhaust management system, the proper choice of such systems is a complex task. Presenting the fundamentals, technical details, and general solutions to real-world problems, Semiconductor Industry: Wafer Fab Exhaust Management offers practical guidance on selecting an

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Overview

Given the myriad exhaust compounds and the corresponding problems that they can pose in an exhaust management system, the proper choice of such systems is a complex task. Presenting the fundamentals, technical details, and general solutions to real-world problems, Semiconductor Industry: Wafer Fab Exhaust Management offers practical guidance on selecting an appropriate system for a given application.

Using examples that provide a clear understanding of the concepts discussed, Sherer covers facility layout, support facilities operations, and semiconductor process equipment, followed by exhaust types and challenges. He reviews exhaust point-of-use devices and exhaust line requirements needed between process equipment and the centralized exhaust system. The book includes information on wet scrubbers for a centralized acid exhaust system and a centralized ammonia exhaust system and on centralized equipment to control volatile organic compounds. It concludes with a chapter devoted to emergency releases and a separate chapter of examples illustrating these systems in use.

Drawing on the author's 20 years of industry experience, the book shows you how to customize strategies specific to your needs, solve current problems, and prevent future issues in your exhaust management systems.

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Product Details

ISBN-13:
9781574447200
Publisher:
Taylor & Francis
Publication date:
07/28/2005
Pages:
216
Sales rank:
1,417,269
Product dimensions:
6.00(w) x 9.30(h) x 0.70(d)

Table of Contents

SEMICONDUCTOR AND WAFER MANUFACTURING FACILITIES
Wafer Fab Layout
Facility-Support Operations
Semiconductor Process Equipment

EXHAUST TYPES AND CHALLENGES
Exhaust Types
Exhaust Management Challenges

POINT-OF-USE DEVICES AND EXHAUST-LINE REQUIREMENTS
Point-Of-Use Device Information
Surrounding Exhaust-Line Requirements
Examples of Point-Of-Use Devices for Selected Processes
Fab Examples of Point-Of-Use Devices
Developing a Point-Of-Use Device and Surrounding Exhaust-Line Strategy
"Development Opportunities" for Point-Of-Use Devices

CENTRALIZED SCRUBBERS
Introduction
General Design and Operation
General Operation Information
Acid Scrubbers for Large Storage Tanks of Concentrated Acid Solution
Centralized Abatement Systems for Higher Inlet Concentrations of Acid Compounds, Chlorine, and Acid Mists
Centralized Scrubbing System for Oxides of Nitrogen
Specifying a Centralized Wet Scrubber

CENTRALIZED EQUIPMENT TO CONTROL VOLATILE ORGANIC COMPOUNDS
Introduction
Centralized Equipment Technologies to Control Volatile Organic Compounds
Examples of Selection Criteria for Centralized Equipment to Control Volatile Organic Compounds
Location of Fans
Testing of Centralized Equipment to Control Volatile Organic Compounds
Specification to Supplier of Centralized Equipment to Control Volatile Organic Compounds

EMERGENCY RELEASES
Introduction
Controlling Releases from Gas Cylinders or Other Vessels
Silane Emergency Release
Reduction of Emergency Release of Concentrations of Stack Discharge

EXHAUST MANAGEMENT AND AIR ABATEMENT EQUIPMENT EXAMPLES
List of Examples
Example No. 7-1
Example No. 7-2
Example No. 7-3
Example No. 7-4
Example No. 7-5

List of Acronyms

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