Table of Contents
PART 1: Semiconductor Fundamentals and Basic Materials BOARD OF REVIEWERS CONTRIBUTORS PREFACE ACKNOWLEDGMENTS Chapter 1: How Semiconductor Chips Are Made - Hwaiyu Geng, Lin Zhou Chapter 2: IC Design - Ilsun Park Chapter 3: Silicon Substrates for Semiconductor Manufacturing - K.V. Ravi Chapter 4: Copper, Low-k Dielectrics, and Their Reliability - Hazara S. Rathore, Kaushik Chanda Chapter 5: Fundamentals-Silicide Formation on Si - L.P. Ren, King N. Tu Chapter 6: Plasma Process Control - David J. Coumou Chapter 7: Vacuum Technology - Peter Biltoft Chapter 8: Photomask - Charles Howard PART 2: Wafer Processing Chapter 9: Microlithography - Chris A. Mack Chapter 10: Ion Implantation and Rapid Thermal Processing - Michael Graf Chapter 11: Wet Etching - Peng Zhang Chapter 12: Plasma Etching - Shouliang Lai Chapter 13: Physical Vapor Deposition - Florian Solzbacher Chapter 14: Chemical Vapor Deposition - Edward J. McInerney Chapter 15: Epitaxy - Jamal Ramdani, Giovanni Vaccari Chapter 16: ECD Fundamentals - Tom Ritzdorf, John Klocks Chapter 17: Chemical Mechanical Planarization - Timothy S. Dyer Chapter 18: Wet Cleaning - Andrew Machamer Part 3: Final Manufacturing Chapter 19: Inspection, Measurement, and Test - Donald W. Blair Chapter 20: Grinding, Stress Relief, and Dicing - Kazuhisa Arai, Yoshikazu Kobayashi, Hideaki Otani Chapter 21: Packaging - Dietrich Tonnies, Michael Topper Part 4: Nanotechnology, MEMS, and FPD Chapter 22: Nanotechnology and Nanomanufacturing - Zhong L. Wang Chapter 23: Fundamentals of Microelectromechanical Systems - Michael A. Huff Chapter 24: Flat-Panel Display Technology and Manufacturing - David N. Liu Part 5: Gases and Chemicals Chapter 25: Specialty Gas and CDA Systems - Wayne D. Curcie Chapter 26: Waste Gas Abatement Systems - Joseph D. Sweeney Chapter 27: PFC Abatement - James C. Cox Chapter 28: Chemical and Slurry Handling Systems - Kristin Cavicchi, Dan Barsness Chapter 29: Fluid Handling Components for High Purity Liquid Chemicals and Slurries - Charles K. Gould Chapter 30: Fundamentals of Ultrapure Water - David J. Albrecht Part 6: Fab Yield, Operations, and Facilities Chapter 31: Yield Management - Bo Li, Wayne Carriker Chapter 32: Automated Material Handling System - Clint Harris Chapter 33: CD Metrology and CD-SEM - Ram Peltinov, Mina Menaker Chapter 34: Six Sigma - Bruno Scibilia, Yoan Dupret Chapter 35: Advanced Process Control - Robert H. McCafferty Chapter 36: Environmental, Health, and Safety (EHS) Considerations in Semiconductor Fabrication Facilities - Brett J. Davis, Steven R. Trammell Chapter 37: Plan, Design, and Construction of a FAB - Industrial Design and Construction Chapter 38: Cleanroom Design and Construction - Richard V. Pavlotsky, Stephen C. Beck Chapter 39: Micro-Vibration and Noise Design - Michael Gandreau, Hal Amick Chapter 40: ESD Controls in Cleanroom Environments - Larry Levit Chapter 41: Airborne Molecular Contamination - Chris Muller Chapter 42: Particle Monitoring in Semiconductor Manufacturing - Steven Kochevar, Jerry Gromala Chapter 43: Wastewater Neutralization Systems - Richard E. Pinkowski APPENDIX INDEX