Signal Propagation on Interconnects / Edition 1

by Hartmut Grabinski, Petra Nordholz

Overview

This book comprises a selection of the most representative contributions to the 1st IEEE Workshop on Signal Propagation on Interconnects that was held at Travemunde, Germany, in May 1997. It represents, therefore, a survey of the actual problems currently concerning researchers and professionals in the field of signal propagation on interconnects.
Signal Propagation on Interconnects contains chapters which cover a wide area of important research results dealing with simulation and measurement of noise and radiated emissions on boards, describing ground bounce effects as well as inductance calculations in multilayer packages. There is also reference and coverage of timing simulation techniques on chip as well as on board level.
Signal Propagation on Interconnects is intended to give developers and researchers in the field of chip and package design a review of the state of the art regarding the influence of interconnect effects on the electrical performance of electronic circuits. In addition, the book illustrates ways to overcome performance problems related to the parasitic influences of interconnects. It is an invaluable text for circuit design engineers, developers and researchers in the field of signal integrity.

Product Details

ISBN-13:	9780792382751
Publisher:	Springer US
Publication date:	10/31/1998
Edition description:	1998
Pages:	148
Product dimensions:	6.14(w) x 9.21(h) x 0.02(d)

Table of Contents

Foreword; J.P. Mucha. Editors' Introduction; P. Nordholz, H. Grabinsky. Analysis of Frequency-Dependent Transmission Lines Using Rational Approximation and Recursive Convolution; W.T. Beyenne, J.E. Schutt-Ainé. Accurate Modeling of Interconnections for Timing Simulation of Sub-Micron Circuits; D. Deschacht, E. Vanier. Minimum Realization of Reduced-Order High-Speed Interconnect Macromodels; R. Achar, M. Nakhla. Lossy Interconnect Modeling for Transient Simulations; I. Maio, F. Canavero. Algorithms Supporting Driver/Receiver Design for Multi-Conductor Interconnects; O.A. Palusinski, et al. Prediction of PCB Susceptibility to Conducted Noise at Post Layout Level; D. Lasagna, et al. Experimental Validation of a Hybrid Method that Predicts Emissions Radiated by Printed Circuit Boards; E. Leroux, et al. Hybrid Time/Frequency-Domain Simulation of Transient Electromagnetic Coupling of Interconnects; A. Dietermann, et al. Simulation of Electromagnetic Wave Propagation on a Printed Circuit Board with Linear and Nonlinear Discrete Loads; M. Witting, T. Proepper. A Model for Ground Bounce Investigation in Structures with Conducting Planes; O. Kosch, et al. Influence of a Floating Plane on an Effective Ground Plane Inductance in Multilayer Packages; M. Lopez, et al. Analysis and Measurement of Crosstalk Induced Delay Errors in Integrated Circuits; F. Moll, et al.

Editorial Reviews

A selection of contributions to a May 1997 workshop, surveying issues in signal propagation on interconnects. Papers report on results dealing with simulation and measurement of noise and radiated emissions on boards, describe ground bounce effects as well as inductance calculations in multilayer packages, discuss timing simulation techniques, and illustrate ways to overcome performance problems. For researchers in chip and package design, circuit design, and signal integrity. No index. Annotation c. by Book News, Inc., Portland, Or.

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