Features include:
• A review of silicon properties which provides a foundation for understanding the device properties discussion, including mobility-enhancement by straining silicon;
• State-of-the-art technologies on high-K gate dielectrics, low-K dielectrics, Cu interconnects, and SiGe BiCMOS;
• CMOS-only applications, such as subthreshold current and parasitic latch-up;
• Advanced Enabling processes and process integration.
This book is written for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science.
Features include:
• A review of silicon properties which provides a foundation for understanding the device properties discussion, including mobility-enhancement by straining silicon;
• State-of-the-art technologies on high-K gate dielectrics, low-K dielectrics, Cu interconnects, and SiGe BiCMOS;
• CMOS-only applications, such as subthreshold current and parasitic latch-up;
• Advanced Enabling processes and process integration.
This book is written for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science.

Silicon Devices and Process Integration: Deep Submicron and Nano-Scale Technologies
598
Silicon Devices and Process Integration: Deep Submicron and Nano-Scale Technologies
598Paperback(Softcover reprint of hardcover 1st ed. 2009)
Product Details
ISBN-13: | 9781441942241 |
---|---|
Publisher: | Springer US |
Publication date: | 10/29/2010 |
Edition description: | Softcover reprint of hardcover 1st ed. 2009 |
Pages: | 598 |
Product dimensions: | 6.10(w) x 9.25(h) x 0.05(d) |