Smart RF Passive Components: Novel Materials, Techniques, and Applications

Smart RF Passive Components: Novel Materials, Techniques, and Applications

by Guo'an Wang, Bo Pan
     
 

Focusing on novel materials and techniques, this pioneering volume provides you with a solid understanding of the design and fabrication of smart RF passive components. You find comprehensive details on LCP, metal materials, ferrite materials, nano materials, high aspect ratio enabled materials, green materials for RFID, and silicon micromachining techniques.

Overview

Focusing on novel materials and techniques, this pioneering volume provides you with a solid understanding of the design and fabrication of smart RF passive components. You find comprehensive details on LCP, metal materials, ferrite materials, nano materials, high aspect ratio enabled materials, green materials for RFID, and silicon micromachining techniques. Moreover, this practical book offers expert guidance on how to apply these materials and techniques to design a wide range of cutting-edge RF passive components, from MEMS switch based tunable passives and 3D passives, to metamaterial-based passives and on-chip passives. Supported with over 145 illustrations, this forward-looking resource summarizes the growing trend of smart RF passive component design and serves as a guide to the performance improving and cost-down solutions this technology offers the next generation of wireless communications.

Product Details

ISBN-13:
9781608071999
Publisher:
Artech House, Incorporated
Publication date:
12/31/2011
Pages:
222
Product dimensions:
7.20(w) x 10.20(h) x 0.90(d)

Meet the Author

Guoan Wang is an advisory engineer/scientist at the IBM Semiconductor Research and Development Center in Essex Junction, Vermont. He holds an M.S. in materials science and engineering from Zhejiang University, an M.S. in electrical engineering from Arizona State University, and a Ph.D. in electrical and computer engineering from the Georgia Institute of Technology. Bo Pan is a senior RF engineer at Realtek Semiconductor Corporation in Irvine, California. He holds an M.S. in electrical engineering from Tsinghua University and a Ph.D. in electrical and computer engineering from the Georgia Institute of Technology.

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