Tribology in Chemical-Mechanical Planarization

Tribology in Chemical-Mechanical Planarization

by Hong Liang, John Givens, David Craven
     
 

ISBN-10: 0824725670

ISBN-13: 9780824725679

Pub. Date: 02/11/2005

Publisher: Taylor & Francis

The role that friction and contact play in the processes of wear and planarization on material surfaces is central to the understanding of Chemical-Mechanical planarization (CMP) technology, particularly when applied to nanosurfaces. Tribology in Chemical-Mechanical Planarization presents a detailed account of the CMP process in a language that is suitable for

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Overview

The role that friction and contact play in the processes of wear and planarization on material surfaces is central to the understanding of Chemical-Mechanical planarization (CMP) technology, particularly when applied to nanosurfaces. Tribology in Chemical-Mechanical Planarization presents a detailed account of the CMP process in a language that is suitable for tribology professionals as well as chemists, materials scientists, physicists, and other applied scientists and engineers in fields of semiconductors and microelectronics. The first half of the book is devoted to CMP, while the other focuses on the fundamentals of tribology.

As the first source to integrate CMP and tribology, the book illustrates the important role that these fields play in manufacturing and technological development. It follows with an examination of tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects. Other topics covered in depth include basics of friction, flash temperature, lubrication fundamentals, basics of wear, polishing particles, and pad wear. The book concludes its focus with CMP practices, discussing mechanical aspects, pad materials, elastic modulus, and cell buckling.

Expanding upon the science and technology of tribology to improve the reliability, maintenance, and wear of technical equipment and other material applications, Tribology in Chemical-Mechanical Planarization provides scientists and engineers with clear foresight to the future of this technology.

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Product Details

ISBN-13:
9780824725679
Publisher:
Taylor & Francis
Publication date:
02/11/2005
Pages:
200
Product dimensions:
6.00(w) x 9.40(h) x 0.70(d)

Table of Contents

INTRODUCTION
Brief History of Tribology
CMP Technology Development
Basic CMP Process

SURFACE PROPERTIES
Physical and Mechanical Characteristics of Surfaces
Wear-Contact of Material Structure
Surface Characterization Techniques
CMP Defects

FRICTION
Basics of Friction
Laws of Friction
Friction Due to Adhesion
Friction Due to Abrasion - Ploughing
Friction Due to Deformation
Flash Temperatures
Friction in CMP

LUBRICATION
Lubrication Regimes
Lubrication Fundamentals
Boundary Lubrication in CMP
Lubrication Behavior in Post-CMP Cleaning
Additive Classification for Slurry Design

WEAR IN CMP
Basics of Wear
Slurry Particles
Pad Wear

FORCE TRANSMISSION
CMP Tour de Force
Elastomeric Foams

CMP PADS
Pad Surface Characteristics
Slurry Depletion
Pad Conditioning

POST-CMP CLEANING

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