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Title: Handbook Of Electronics Packaging Design and Engineering, Author: Bernard S. Matisoff
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Handbook Of Electronics…
by Bernard S. Matisoff
Paperback $54.99
Title: The Basics of Soldering, Author: Armin Rahn
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The Basics of Soldering
by Armin Rahn
Hardcover $312.95
Title: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications, Author: Dean L. Monthei
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Package Electrical Modeling,…
by Dean L. Monthei
#2 in Series
Hardcover $109.99
Title: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging, Author: Xing-Chang Wei
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Modeling and Design of…
by Xing-Chang Wei
eBook $63.99
Title: Advanced Materials for Thermal Management of Electronic Packaging, Author: Xingcun Colin Tong
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Advanced Materials for Thermal…
by Xingcun Colin Tong
#30 in Series
Hardcover $279.99
Title: Electronic Packaging for High Reliability, Low Cost Electronics, Author: R.R. Tummala
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Electronic Packaging for High…
by R.R. Tummala (Editor), Marija Kosec (Editor), W.K. Jones (Editor), Darko Belavic (Editor)
#57 in Series
Hardcover $169.99
Title: Chip On Board: Technology for Multichip Modules, Author: John H. Lau
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Chip On Board: Technology for…
by John H. Lau
Explore Series
Hardcover $219.99
Title: Advanced Wirebond Interconnection Technology, Author: Shankara K. Prasad
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Advanced Wirebond…
by Shankara K. Prasad
Other Format $329.99
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, Author: Ali Jamnia
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Practical Guide to the…
by Ali Jamnia
Paperback $68.99
Title: Electronic Packaging and Interconnection Handbook, Author: Charles A. Harper
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Electronic Packaging and…
by Charles A. Harper
Hardcover $250.00
Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability, Author: James J. Licari
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Adhesives Technology for…
by James J. Licari, Dale W. Swanson
Explore Series
eBook $225.00
Title: The Electronic Packaging Handbook, Author: Glenn R. Blackwell
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The Electronic Packaging…
by Glenn R. Blackwell (Editor)
#4 in Series
Hardcover $325.00
Title: MCM C/Mixed Technologies and Thick Film Sensors, Author: W.K. Jones
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MCM C/Mixed Technologies and…
by W.K. Jones (Editor), Karel Kurzweil (Editor), Gábor Harsányi (Editor), Sylvia Mergui (Editor)
#2 in Series
Hardcover $219.99
Title: Boundary-Scan Interconnect Diagnosis, Author: José T. de Sousa
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Boundary-Scan Interconnect…
by José T. de Sousa, Peter Y.K. Cheung
#18 in Series
Paperback $169.99
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
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Influence of Temperature on…
by Pradeep Lall, Michael Pecht, Edward B. Hakim
Paperback $54.99
Title: The Electronics Assembly Handbook, Author: Frank Riley
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The Electronics Assembly…
by Frank Riley (Editor), Electronic Packaging and Production (Editor)
Paperback $199.99
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, Author: Ali Jamnia
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Practical Guide to the…
by Ali Jamnia
eBook $55.99
Title: Physical Design for Multichip Modules, Author: Mysore Sriram
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Physical Design for Multichip…
by Mysore Sriram, Sung-Mo (Steve) Kang
#267 in Series
Paperback $169.99
Title: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, Author: Karl J. Puttlitz
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Handbook of Lead-Free Solder…
by Karl J. Puttlitz, Kathleen A. Stalter
Explore Series
Hardcover $555.00
Title: Microscale Heat Transfer - Fundamentals and Applications: Proceedings of the NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems, Cesme-Izmir, Turkey, 18-30 July, 2004, Author: S. Kakaç
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Microscale Heat Transfer -…
by S. Kakaç (Editor), L.L. Vasiliev (Editor), Y. Bayazitoglu (Editor), Y. Yener (Editor)
#193 in Series
Hardcover $329.99

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