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Title: Handbook Of Electronics Packaging Design and Engineering, Author: Bernard S. Matisoff
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Handbook Of Electronics…
by Bernard S. Matisoff
Paperback $54.99
Title: The Electronics Assembly Handbook, Author: Frank Riley
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The Electronics Assembly…
by Frank Riley (Editor), Electronic Packaging and Production (Editor)
Paperback $199.99
Title: Handbook Of Tape Automated Bonding, Author: John H. Lau
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Handbook Of Tape Automated…
by John H. Lau
Hardcover $219.99
Title: Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability, Author: Michael G. Pecht
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Integrated Circuit, Hybrid,…
by Michael G. Pecht
Hardcover $212.95
Title: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications, Author: Dean L. Monthei
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Package Electrical Modeling,…
by Dean L. Monthei
#2 in Series
Hardcover $109.99
Title: Electronic Equipment Packaging Technology, Author: Gerald L. Ginsberg
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Electronic Equipment Packaging…
by Gerald L. Ginsberg
Hardcover $109.99
Title: Quality Conformance and Qualification of Microelectronic Packages and Interconnects, Author: Michael G. Pecht
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Quality Conformance and…
by Michael G. Pecht (Editor), Abhijit Dasgupta (Editor), John W. Evans (Editor), Jillian Y. Evans (Editor)
Paperback $188.95
Title: Physical Design for Multichip Modules, Author: Mysore Sriram
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Physical Design for Multichip…
by Mysore Sriram, Sung-Mo (Steve) Kang
#267 in Series
Paperback $169.99
Title: Heat Transfer: Thermal Management of Electronics, Author: Younes Shabany
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Heat Transfer: Thermal…
by Younes Shabany
eBook $180.00
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing, Author: Shen Liu
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LED Packaging for Lighting…
by Shen Liu, Xiaobing Luo
eBook $144.00
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
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Influence of Temperature on…
by Pradeep Lall, Michael Pecht, Edward B. Hakim
Paperback $54.99
Title: Thermal Stress and Strain in Microelectronics Packaging, Author: John Lau
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Thermal Stress and Strain in…
by John Lau (Editor)
Paperback $169.99
Title: Guidebook for Managing Silicon Chip Reliability, Author: Michael Pecht
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Guidebook for Managing Silicon…
by Michael Pecht, Riko Radojcic, Gopal Rao
#5 in Series
Hardcover $140.00
Title: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging, Author: Xing-Chang Wei
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Modeling and Design of…
by Xing-Chang Wei
Paperback $59.99
Title: High Temperature Electronics, Author: F. Patrick McCluskey
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High Temperature Electronics
by F. Patrick McCluskey, Thomas Podlesak, Richard Grzybowski
Explore Series
Hardcover $240.00
Title: Mechanical Analysis of Electronic Packaging Systems, Author: Stephen A. McKeown
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Mechanical Analysis of…
by Stephen A. McKeown
Paperback $86.99
Title: Electronics Packaging Forum: Volume Two, Author: James E. Morris
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Electronics Packaging Forum:…
by James E. Morris
Paperback $54.99
Title: Lead-Free Soldering in Electronics: Science, Technology, and Environmental Impact, Author: Katsuaki Suganuma
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Lead-Free Soldering in…
by Katsuaki Suganuma
eBook $240.00
Title: Advanced Materials for Thermal Management of Electronic Packaging, Author: Xingcun Colin Tong
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Advanced Materials for Thermal…
by Xingcun Colin Tong
#30 in Series
Paperback $279.99
Title: High Temperature Electronics, Author: F. Patrick McCluskey
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High Temperature Electronics
by F. Patrick McCluskey, Thomas Podlesak, Richard Grzybowski
eBook $86.99

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