Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability, Author: James J. Licari
Title: Thermal Stress and Strain in Microelectronics Packaging, Author: John Lau
Title: Lead-Free Soldering in Electronics: Science, Technology, and Environmental Impact, Author: Katsuaki Suganuma
Title: Handbook of Electronic Package Design, Author: Michael Pecht
Title: Boundary-Scan Interconnect Diagnosis / Edition 1, Author: José T. de Sousa
Title: High Temperature Electronics / Edition 1, Author: F. Patrick McCluskey
Title: Electronic Equipment Packaging Technology / Edition 1, Author: Gerald L. Ginsberg
Title: Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic research and development in Japan / Edition 1, Author: K. Otsuka
Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability / Edition 2, Author: James J. Licari
Title: Advanced Materials for Thermal Management of Electronic Packaging / Edition 1, Author: Xingcun Colin Tong
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing / Edition 1, Author: Shen Liu
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, Author: Ali Jamnia
Title: Fundamentals and Essentials of Electronic Packaging, Author: Puligandla Viswanadham
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing, Author: Shen Liu
Title: Contamination of Electronic Assemblies / Edition 1, Author: Elissa M. Bumiller
Title: The Electronics Assembly Handbook, Author: Frank Riley
Title: Mechanical Analysis of Electronic Packaging Systems, Author: Stephen A. McKeown
Title: Electronic Packaging and Interconnection Handbook / Edition 4, Author: Charles A. Harper
Title: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications / Edition 1, Author: Dean L. Monthei
Title: Thermal Design of Electronic Equipment, Author: Ralph Remsburg

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