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Title: CAE - CAD and Thermal Management Issues in Electronic Systems: Proceedings, ASME International Mechanical Engineering Congress and Exposition, Dallas, TX, 1997, Author: Dereje Agonafer
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CAE - CAD and Thermal…
by Dereje Agonafer (Editor)
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Paperback $72.00
Title: Electronic Packaging for High Reliability, Low Cost Electronics, Author: R.R. Tummala
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Electronic Packaging for High…
by R.R. Tummala (Editor), Marija Kosec (Editor), W.K. Jones (Editor), Darko Belavic (Editor)
#57 in Series
Hardcover $169.99
Title: Handbook of Electronic Package Design, Author: Michael Pecht
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Handbook of Electronic Package…
by Michael Pecht
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eBook $550.00
Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability, Author: James J. Licari
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Adhesives Technology for…
by James J. Licari, Dale W. Swanson
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eBook $225.00
Title: High Temperature Electronics, Author: F. Patrick McCluskey
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High Temperature Electronics
by F. Patrick McCluskey, Thomas Podlesak, Richard Grzybowski
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Hardcover $240.00

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