Title: Boundary-Scan Test: A Practical Approach, Author: Harry Bleeker
Title: High-Speed Circuit Board Signal Integrity, Author: Stephen C. Thierauf
Title: Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly, Author: Jennie Hwang
Title: Signal Propagation on Interconnects, Author: Hartmut Grabinski
Title: Complete PCB Design Using OrCAD Capture and PCB Editor, Author: Kraig Mitzner
Title: Soldering Handbook For Printed Circuits and Surface Mounting, Author: Howard H. Manko
Title: Placement and Routing of Electronic Modules, Author: Michael Pecht
Title: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging, Author: Xing-Chang Wei
Title: Structural Analysis of Printed Circuit Board Systems, Author: Peter A. Engel
Title: Sub-Half-Micron Lithography for ULSIs, Author: Katsumi Suzuki
Title: EMC at Component and PCB Level, Author: MSc Physical Measurement Techniques and Instrument O 'Hara BSc (Hons) Applied Physics and Electronics
Title: Placement and Routing of Electronic Modules, Author: Michael Pecht
Title: Handbook of Printed Circuit Manufacturing, Author: Raymond H. Clark
Title: PCB Currents: How They Flow, How They React, Author: Douglas Brooks
Title: In-Circuit Testing, Author: John T. Bateson
Title: Printed circuit board assembly: The Complete Works, Author: P.J.W. Noble
Title: Analog and Mixed-Signal Boundary-Scan: A Guide to the IEEE 1149.4 Test Standard, Author: Adam Osseiran
Title: Foldable Flex and Thinned Silicon Multichip Packaging Technology, Author: John W. Balde
Title: Printed Organic and Molecular Electronics, Author: Daniel R. Gamota

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