Title: Cleaning Printed Wiring Assemblies in Today's Environment, Author: L. Hymes
Title: In-Circuit Testing, Author: John T. Bateson
Title: Placement and Routing of Electronic Modules / Edition 1, Author: Michael Pecht
Title: Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly, Author: Jennie Hwang
Title: The Boundary-Scan Handbook, Author: Kenneth P. Parker
Title: Printed Circuit Engineering: Optimizing for Manufacturability, Author: Raymond H. Clark
Title: Complete PCB Design Using OrCAD Capture and PCB Editor, Author: Kraig Mitzner
Title: Handbook of Printed Circuit Manufacturing, Author: Raymond H. Clark
Title: Printed circuit board assembly: The Complete Works, Author: P.J.W. Noble
Title: The Boundary-Scan Handbook: Analog and Digital, Author: Kenneth P. Parker
Title: Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly, Author: Jennie S. Hwang
Title: The Boundary - Scan Handbook, Author: Kenneth P. Parker