Title: Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly, Author: Jennie S. Hwang
Title: Handbook of Printed Circuit Manufacturing, Author: Raymond H. Clark
Title: Sub-Half-Micron Lithography for ULSIs, Author: Katsumi Suzuki
Title: Printed Circuit Engineering: Optimizing for Manufacturability, Author: Raymond H. Clark
Title: Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly, Author: Jennie Hwang
Title: Printed circuit board assembly: The Complete Works, Author: P.J.W. Noble
Title: Placement and Routing of Electronic Modules, Author: Michael Pecht
Title: Structural Analysis of Printed Circuit Board Systems, Author: Peter A. Engel