Title: Mechanical Analysis of Electronic Packaging Systems / Edition 1, Author: Stephen A. McKeown
Title: Hermeticity of Electronic Packages / Edition 2, Author: Hal Greenhouse
Title: Guidebook for Managing Silicon Chip Reliability / Edition 1, Author: Michael Pecht
Title: The Handbook of Machine Soldering: SMT and TH / Edition 3, Author: Ralph W. Woodgate
Title: MCM C/Mixed Technologies and Thick Film Sensors / Edition 1, Author: W.K. Jones
Title: Advanced Wirebond Interconnection Technology / Edition 1, Author: Shankara K. Prasad
Title: Thermal Design of Electronic Equipment / Edition 1, Author: Ralph Remsburg
Title: Mechanical Analysis of Electronic Packaging Systems / Edition 1, Author: Stephen A. McKeown
Title: Advanced Materials for Thermal Management of Electronic Packaging / Edition 1, Author: Xingcun Colin Tong
Title: Electronic Packaging Materials and Their Properties / Edition 1, Author: Michael Pecht
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing / Edition 1, Author: Shen Liu
Title: Contamination of Electronic Assemblies / Edition 1, Author: Elissa M. Bumiller
Title: Electronic Packaging and Interconnection Handbook / Edition 4, Author: Charles A. Harper
Title: High Temperature Electronics / Edition 1, Author: F. Patrick McCluskey
Title: Physical Design for Multichip Modules / Edition 1, Author: Mysore Sriram
Title: Manufacturing Challenges in Electronic Packaging / Edition 1, Author: Y.C. Lee
Title: High Temperature Electronics / Edition 1, Author: F. Patrick McCluskey
Title: Air Cooling Technology for Electronic Equipment / Edition 1, Author: Sung Jin Kim
Title: Electronic Equipment Packaging Technology / Edition 1, Author: Gerald L. Ginsberg
Title: Failure Modes and Mechanisms in Electronic Packages / Edition 1, Author: P. Singh

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