3D Microelectronic Packaging: From Fundamentals to Applications

3D Microelectronic Packaging: From Fundamentals to Applications

Paperback(Softcover reprint of the original 1st ed. 2017)

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Product Details

ISBN-13: 9783319830865
Publisher: Springer International Publishing
Publication date: 07/12/2018
Series: Springer Series in Advanced Microelectronics , #57
Edition description: Softcover reprint of the original 1st ed. 2017
Pages: 463
Product dimensions: 6.10(w) x 9.25(h) x (d)

Table of Contents


Introduction to 3D Microelectronic Packaging.-3D packaging architecture and assembly process design.-Materials and Processing of TSV.-Microstructural and Reliability Issues of TSV.- Fundamentals and failures in Die preparation for 3D packaging.-Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging.- Fundamental of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages .- Fundamentals of solder alloys in 3D packaging.-Fundamentals of Electromigration in interconnects of 3D packages.-Fundamentals of heat dissipation in 3D IC packaging.- Fundamentals of advanced materials and processes in organic substrate technology.- Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization.- Processing and Reliability of Solder Interconnections in Stacked Packaging.- Interconnect Quality and Reliability of 3D Packaging.- Fault isolation and failure analysis of 3D packaging.

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