Advanced Metallization Conference 2008 (AMC 2008): Volume 24

Advanced Metallization Conference 2008 (AMC 2008): Volume 24

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Overview

Advanced Metallization Conference 2008 (AMC 2008): Volume 24 by Mehul Naik, R. Shaviv, T. Yoda, K. Ueno

The Advanced Metallization Conference - held in San Diego, California, and Tokyo, Japan - marked its 25th anniversary in 2008. These two sister conferences form a unique 'one conference at two sites' that focuses on the latest R&D and manufacturing results, as well as real-world integration and reliability data on the application of metallization and related technologies for advanced IC devices. Scientists and engineers from around the world came to listen and present state-of-the-art work in the field of ULSI interconnect technology including metallization, dielectrics, integration, packaging, design and vertical integration. A keynote address by Gary Patton, vice president, IBM Systems and Technology Group, on 'Leading-edge Silicon Technology through Innovation and Collaboration', is featured. Additional topics include: integration; metallization; materials and characterization; CMP and cleaning; 3D integration and packaging; low-k materials; and reliability and yield.

Product Details

ISBN-13: 9781605111254
Publisher: Materials Research Society
Publication date: 01/01/2009
Series: MRS Proceedings Series
Pages: 769
Product dimensions: 6.30(w) x 9.30(h) x 1.80(d)

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