This book joins and integrates ceramics and ceramic-based materials in various sectors of technology. A major imperative is to extract scientific information on joining and integration response of real, as well as model, material systems currently in a developmental stage.
This book envisions integration in its broadest sense as a fundamental enabling technology at multiple length scales that span the macro, millimeter, micrometer and nanometer ranges. Consequently, the book addresses integration issues in such diverse areas as space power and propulsion, thermoelectric power generation, solar energy, micro-electro-mechanical systems (MEMS), solid oxide fuel cells (SOFC), multi-chip modules, prosthetic devices, and implanted biosensors and stimulators. The engineering challenge of designing and manufacturing complex structural, functional, and smart components and devices for the above applications from smaller, geometrically simpler units requires innovative development of new integration technology and skillful adaptation of existing technology.
|Product dimensions:||6.40(w) x 9.30(h) x 1.80(d)|
About the Author
Mrityunjay Singh, PhD, FASM, FACerS, FAAAS, is Chief Scientistat Ohio Aerospace Institute, NASA Glenn Research Center, and isactively involved in various activities related to processing,manufacturing, joining and attachment technologies. He isAcademician of World Academy of Ceramics and Governor of ActaMaterialia, Inc. He has authored or coauthored more than twohundred thirty publications, edited forty two books/journalvolumes, and holds several patents and technology transfers toindustries. He is recipient of numerous (more than forty) nationaland international awards from all over the world including fourR&D 100 awards, NASA Public Service Medal, and NASA ExceptionalSpace Act Award for outstanding and extraordinary contributions tovarious NASA programs.
Tatsuki Ohji, PhD, FACerS, is the Prime Senior ResearchScientist at Japan's National Institute of Advanced IndustrialScience and Technology (AIST). His research interests includecharacterization of ceramics, ceramic composites and porousmaterials, design of advanced ceramics, and green ceramicmanufacturing. He has authored or coauthored more than 320scientific papers and nine books, and holds more than fortypatents. He is a fellow of the American Ceramic Society,Academician of the World Academy of Ceramics, a Governor of ActaMaterialia, Inc., and editorial board member of many internationaljournals.
Rajiv Asthana, PhD, FASM, is a professor at the University ofWisconsin-Stout where he teaches in the manufacturing engineeringand engineering technology programs. His research interests includeceramic/metal joining, high-temperature capillarity and castmetal-matrix composites. He is the author or coauthor of four booksand 150 refereed papers, an Associate Editor of Journal ofMaterials Engineering & Performance, guest editor and editorialboard member of several refereed journals, and a fellow of ASMInternational.
Sanjay Mathur, PhD, is professor at the Institute of InorganicChemistry at the University of Cologne, Germany. The major researchthrust of his group include chemical synthesis of functionalnanostructures and their processing for product and deviceapplications. He was an Alexander von Humboldt Fellow at theSaarland University, where he accomplished his Habilitation. He hasauthored or coauthored over 150 publications, edited a book, holdsseveral patents, and is and Associate Editor of InternationalJournal of Applied Ceramic Technology and Nanomaterials.
Table of Contents
PART I INTRODUCTION 1
1 CERAMIC INTEGRATION ACROSS LENGTH SCALES: TECHNICAL ISSUES,CHALLENGES, AND OPPORTUNITIES 3Mrityunjay Singh, Tatsuki Ohji, Rajiv Asthana, and SanjayMathur
PART II SCIENCE AND TECHNOLOGY FOR MACROSCALE INTEGRATION15
2 CERAMIC COMPONENT INTEGRATION BY ADVANCED BRAZING TECHNOLOGIES17Jolanta Janczak-Rusch
3 JOINING AND INTEGRATION ISSUES OF CERAMIC MATRIX COMPOSITESFOR THE NUCLEAR INDUSTRY 39Monica Ferraris, Milena Salvo, and Valentina Casalegno
4 AIR BRAZING: A NEW METHOD OF CERAMIC–CERAMIC ANDCERAMIC–METAL JOINING 91K. S. Weil, J. T. Darsell, and J. Y. Kim
5 DIFFUSION BONDING OF SILICON CARBIDE AS AN ENABLING TECHNOLOGYFOR THE FABRICATION OF COMPLEX-SHAPED CERAMIC COMPONENTS 143Michael C. Halbig and Mrityunjay Singh
6 INTEGRATION OF CARBON–CARBON COMPOSITE TO METALLICSYSTEMS FOR THERMAL MANAGEMENT APPLICATIONS 163Mrityunjay Singh and Rajiv Asthana
7 CONTACT INTERACTION IN CARBON–METAL SYSTEMS FOR JOININGAND INTEGRATION 193V. M. Perevertailo and O. B. Loginova
PART III INTEGRATION ISSUES IN ENERGY GENERATION AND DEVICEFABRICATION 231
8 INTEGRATION TECHNOLOGIES FOR FERRITES AND POWER INDUCTORS INCERAMIC CIRCUIT BOARDS 233Richard Matz
9 OXIDE THERMOELECTRIC POWER GENERATION 267Ryoji Funahashi, Saori Urata, Atsuko Kosuga, and DelphineFlahaut
10 INTEGRATION TECHNOLOGIES FOR SOLID OXIDE FUEL CELLS (SOFCS)AND OTHER ELECTROCHEMICAL REACTORS 297Yoshinobu Fujishiro, Toshio Suzuki, Toshiro Yamaguchi, KoichiHamamoto, Masanobu Awano, and Nigel Sammes
11 INTEGRATION TECHNOLOGIES FOR SENSORS 323Woosuck Shin, Maiko Nishibori, and Ichiro Matsubara
12 ON-CHIP INTEGRATION OF FUNCTIONAL HYBRID MATERIALS ANDCOMPONENTS IN NANOPHOTONICS AND OPTOELECTRONICS 339Talha Erdem and Hilmi Volkan Demir
13 INTEGRATION OF MULTIFUNCTIONAL PROPERTIES IN THERMAL BARRIERCOATINGS BY CHEMICAL VAPOR DEPOSITION 393Takashi Goto
14 THE CHANGING PHYSICS IN METAL INTERCONNECT RELIABILITY415Cher Ming Tan and Yuejin Hou
15 INTEGRATION ISSUES OF BARIUM STRONTIUM TITANATE THIN FILM FORTUNABLE MICROWAVE APPLICATIONS 449Ashok Kumar, Supriya Ketkar, and Venkataraman Gurumurthy
16 AEROSOL DEPOSITION (AD) INTEGRATION TECHNIQUES AND THEIRAPPLICATION TO MICRODEVICES 489Jun Akedo
PART IV NANO- AND BIOINTEGRATION 521
17 ADVANCES IN NANOINTEGRATION METHODOLOGIES: PATTERNING,POSITIONING, AND SELF-ASSEMBLY 523Yoshitake Masuda and Kunihito Koumoto
18 INTEGRATION OF NANOWIRES IN NEW DEVICES AND CIRCUITARCHITECTURES: RECENT DEVELOPMENTS AND CHALLENGES 575F. Hernández-Ramírez, J. D. Prades, A.Romano-Rodriguez, S. Barth, H. Shen, and S. Mathur
19 INTEGRATING DIAMOND-LIKE CARBON INTO NANOSTRUCTURE DESIGNS(FABRICATING MICROSCALE AND NANOSCALE ARCHITECTURES OF DIAMOND-LIKECARBON FILMS) 641Xijun Li and Daniel H. C. Chua
20 SYNTHESIS, PROPERTIES, INTEGRATION, AND APPLICATIONS OFVERTICALLY ALIGNED CERAMIC NANOSTRUCTURES 671D. Pliszka, S. Sundarrajan, and S. Ramakrishna
21 NANOINTEGRATION BASED ON THIN-FILM TECHNOLOGY 699C. Jin, W. Wei, R. Aggarwal, and R. J. Narayan
22 MASS-MANUFACTURABLE NANOWIRE INTEGRATION: CHALLENGES ANDRECENT DEVELOPMENTS 721Ataur Sarkar and M. Saif Islam
23 USABILITY OF INK-JET PRINTING TECHNOLOGY AND NANOMATERIALS INELECTRICAL INTERCONNECTIONS, ELECTRONIC PACKAGING, AND SYSTEMINTEGRATION FOR MICROELECTRONICS APPLICATIONS 743Umur Caglar, Ville Pekkanen, Jani Valkama, PauliinaMansikkamäki, and Jussi Pekkanen
24 BIOINTEGRATION OF PROSTHETIC DEVICES 777Masakazu Kawashita, Toshiki Miyazaki, and ChikaraOhtsuki