ISBN-10:
0470391227
ISBN-13:
9780470391228
Pub. Date:
10/11/2011
Publisher:
Wiley
Ceramic Integration and Joining Technologies: From Macro to Nanoscale / Edition 1

Ceramic Integration and Joining Technologies: From Macro to Nanoscale / Edition 1

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Product Details

ISBN-13: 9780470391228
Publisher: Wiley
Publication date: 10/11/2011
Pages: 830
Product dimensions: 6.40(w) x 9.30(h) x 1.80(d)

About the Author

Mrityunjay Singh, PhD, FASM, FACerS, FAAAS, is Chief Scientistat Ohio Aerospace Institute, NASA Glenn Research Center, and isactively involved in various activities related to processing,manufacturing, joining and attachment technologies. He isAcademician of World Academy of Ceramics and Governor of ActaMaterialia, Inc. He has authored or coauthored more than twohundred thirty publications, edited forty two books/journalvolumes, and holds several patents and technology transfers toindustries. He is recipient of numerous (more than forty) nationaland international awards from all over the world including fourR&D 100 awards, NASA Public Service Medal, and NASA ExceptionalSpace Act Award for outstanding and extraordinary contributions tovarious NASA programs.

Tatsuki Ohji, PhD, FACerS, is the Prime Senior ResearchScientist at Japan's National Institute of Advanced IndustrialScience and Technology (AIST). His research interests includecharacterization of ceramics, ceramic composites and porousmaterials, design of advanced ceramics, and green ceramicmanufacturing. He has authored or coauthored more than 320scientific papers and nine books, and holds more than fortypatents. He is a fellow of the American Ceramic Society,Academician of the World Academy of Ceramics, a Governor of ActaMaterialia, Inc., and editorial board member of many internationaljournals.

Rajiv Asthana, PhD, FASM, is a professor at the University ofWisconsin-Stout where he teaches in the manufacturing engineeringand engineering technology programs. His research interests includeceramic/metal joining, high-temperature capillarity and castmetal-matrix composites. He is the author or coauthor of four booksand 150 refereed papers, an Associate Editor of Journal ofMaterials Engineering & Performance, guest editor and editorialboard member of several refereed journals, and a fellow of ASMInternational.

Sanjay Mathur, PhD, is professor at the Institute of InorganicChemistry at the University of Cologne, Germany. The major researchthrust of his group include chemical synthesis of functionalnanostructures and their processing for product and deviceapplications. He was an Alexander von Humboldt Fellow at theSaarland University, where he accomplished his Habilitation. He hasauthored or coauthored over 150 publications, edited a book, holdsseveral patents, and is and Associate Editor of InternationalJournal of Applied Ceramic Technology and Nanomaterials.

Table of Contents

Preface ix

Contributors xi

PART I INTRODUCTION 1

1 CERAMIC INTEGRATION ACROSS LENGTH SCALES: TECHNICAL ISSUES,CHALLENGES, AND OPPORTUNITIES 3
Mrityunjay Singh, Tatsuki Ohji, Rajiv Asthana, and SanjayMathur

PART II SCIENCE AND TECHNOLOGY FOR MACROSCALE INTEGRATION15

2 CERAMIC COMPONENT INTEGRATION BY ADVANCED BRAZING TECHNOLOGIES17
Jolanta Janczak-Rusch

3 JOINING AND INTEGRATION ISSUES OF CERAMIC MATRIX COMPOSITESFOR THE NUCLEAR INDUSTRY 39
Monica Ferraris, Milena Salvo, and Valentina Casalegno

4 AIR BRAZING: A NEW METHOD OF CERAMIC–CERAMIC ANDCERAMIC–METAL JOINING 91
K. S. Weil, J. T. Darsell, and J. Y. Kim

5 DIFFUSION BONDING OF SILICON CARBIDE AS AN ENABLING TECHNOLOGYFOR THE FABRICATION OF COMPLEX-SHAPED CERAMIC COMPONENTS 143
Michael C. Halbig and Mrityunjay Singh

6 INTEGRATION OF CARBON–CARBON COMPOSITE TO METALLICSYSTEMS FOR THERMAL MANAGEMENT APPLICATIONS 163
Mrityunjay Singh and Rajiv Asthana

7 CONTACT INTERACTION IN CARBON–METAL SYSTEMS FOR JOININGAND INTEGRATION 193
V. M. Perevertailo and O. B. Loginova

PART III INTEGRATION ISSUES IN ENERGY GENERATION AND DEVICEFABRICATION 231

8 INTEGRATION TECHNOLOGIES FOR FERRITES AND POWER INDUCTORS INCERAMIC CIRCUIT BOARDS 233
Richard Matz

9 OXIDE THERMOELECTRIC POWER GENERATION 267
Ryoji Funahashi, Saori Urata, Atsuko Kosuga, and DelphineFlahaut

10 INTEGRATION TECHNOLOGIES FOR SOLID OXIDE FUEL CELLS (SOFCS)AND OTHER ELECTROCHEMICAL REACTORS 297
Yoshinobu Fujishiro, Toshio Suzuki, Toshiro Yamaguchi, KoichiHamamoto, Masanobu Awano, and Nigel Sammes

11 INTEGRATION TECHNOLOGIES FOR SENSORS 323
Woosuck Shin, Maiko Nishibori, and Ichiro Matsubara

12 ON-CHIP INTEGRATION OF FUNCTIONAL HYBRID MATERIALS ANDCOMPONENTS IN NANOPHOTONICS AND OPTOELECTRONICS 339
Talha Erdem and Hilmi Volkan Demir

13 INTEGRATION OF MULTIFUNCTIONAL PROPERTIES IN THERMAL BARRIERCOATINGS BY CHEMICAL VAPOR DEPOSITION 393
Takashi Goto

14 THE CHANGING PHYSICS IN METAL INTERCONNECT RELIABILITY415
Cher Ming Tan and Yuejin Hou

15 INTEGRATION ISSUES OF BARIUM STRONTIUM TITANATE THIN FILM FORTUNABLE MICROWAVE APPLICATIONS 449
Ashok Kumar, Supriya Ketkar, and Venkataraman Gurumurthy

16 AEROSOL DEPOSITION (AD) INTEGRATION TECHNIQUES AND THEIRAPPLICATION TO MICRODEVICES 489
Jun Akedo

PART IV NANO- AND BIOINTEGRATION 521

17 ADVANCES IN NANOINTEGRATION METHODOLOGIES: PATTERNING,POSITIONING, AND SELF-ASSEMBLY 523
Yoshitake Masuda and Kunihito Koumoto

18 INTEGRATION OF NANOWIRES IN NEW DEVICES AND CIRCUITARCHITECTURES: RECENT DEVELOPMENTS AND CHALLENGES 575
F. Hernández-Ramírez, J. D. Prades, A.Romano-Rodriguez, S. Barth, H. Shen, and S. Mathur

19 INTEGRATING DIAMOND-LIKE CARBON INTO NANOSTRUCTURE DESIGNS(FABRICATING MICROSCALE AND NANOSCALE ARCHITECTURES OF DIAMOND-LIKECARBON FILMS) 641
Xijun Li and Daniel H. C. Chua

20 SYNTHESIS, PROPERTIES, INTEGRATION, AND APPLICATIONS OFVERTICALLY ALIGNED CERAMIC NANOSTRUCTURES 671
D. Pliszka, S. Sundarrajan, and S. Ramakrishna

21 NANOINTEGRATION BASED ON THIN-FILM TECHNOLOGY 699
C. Jin, W. Wei, R. Aggarwal, and R. J. Narayan

22 MASS-MANUFACTURABLE NANOWIRE INTEGRATION: CHALLENGES ANDRECENT DEVELOPMENTS 721
Ataur Sarkar and M. Saif Islam

23 USABILITY OF INK-JET PRINTING TECHNOLOGY AND NANOMATERIALS INELECTRICAL INTERCONNECTIONS, ELECTRONIC PACKAGING, AND SYSTEMINTEGRATION FOR MICROELECTRONICS APPLICATIONS 743
Umur Caglar, Ville Pekkanen, Jani Valkama, PauliinaMansikkamäki, and Jussi Pekkanen

24 BIOINTEGRATION OF PROSTHETIC DEVICES 777
Masakazu Kawashita, Toshiki Miyazaki, and ChikaraOhtsuki

Index 803

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