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Chemical Mechanical Planarization of Microelectronic Materials / Edition 1

Chemical Mechanical Planarization of Microelectronic Materials / Edition 1


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Product Details

ISBN-13: 9780471138273
Publisher: Wiley
Publication date: 01/28/1997
Pages: 337
Product dimensions: 6.95(w) x 9.70(h) x 0.90(d)

About the Author

JOSEPH M. STEIGERWALD, PhD, works for the Intel Corporation inHillsboro, Oregon. Currently developing CMP processes fordielectric films, he has also worked for Intel in the areas ofplasma and wet etching of thin films. Dr. Steigerwald earned hisPhD at Rensselaer Polytechnic Institute, where his thesis involvedfundamental aspects of copper CMP. He holds a bachelor's degree inelectrical engineering from Clarkson University.

SHYAM P. MURARKA, PhD, is Director of the SRC Center for AdvancedInterconnect Science and Technology at Rensselaer PolytechnicInstitute, and a professor with the Center for IntegratedElectronics and Electronics Manufacturing (CIEEM) and the MaterialsScience and Engineering Department at Rensselaer. He has alsoserved as the Director of CIEEM (1994-1996) and Co-Director of NewYork's SEMATECH Center of Excellence in Multilevel Interconnects(1990-1996). He is a Fellow of ASM International, IEEE, and AVS,and a member of the Electrochemical Society, TMS, and MRS. Dr.Murarka received a doctorate in chemistry from Agra University inIndia and one in metallurgy and materials science from theUniversity of Minnesota.

RONALD J. GUTMANN, PhD, is Professor in Rensselaer PolytechnicInstitute's Department of Electrical, Computer and SystemsEngineering, Coordinator of multifaculty programs in Low DielectricConstant Interconnect Technology and Thermophotovoltaic CellTechnology, and a member of both the SEMATECH University AdvisoryCouncil and the Semiconductor Research Corporation UniversityAdvisory Committee. From 1989 to 1994 he served as Director of theRensselaer Center for Integrated Electronics, an interdisciplinaryresearch and education center involving 50 faculty with programs inelectronic materials, processing techniques, semiconductor devices,characterization techniques, and VLSI design, and from 1990 to 1996as Co-Director of New York's Sematech Center of Excellence inMultilevel Interconnects. He is a Fellow of ieee. Dr. Gutmannreceived both his bachelor of electrical engineering degree anddoctorate in electrophysics from Rensselaer Polytechnic Institute.

Table of Contents

Chemical Mechanical Planarization-An Introduction.

Historical Motivations for CMP.

CMP Variables and Manipulations.

Mechanical and Electrochemical Concepts for CMP.

Oxide CMP Process-Mechanisms and Models.

Tungsten and CMP Processes.

Copper CMP.

CMP of Other Materials and New CMP Applications.

Post-CMP Cleanup.



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