Digital Integrated Circuits / Edition 2

Digital Integrated Circuits / Edition 2

Pub. Date:
Select a Purchase Option (REV)
  • purchase options
    $71.26 $249.00 Save 71%
    • Free return shipping at the end of the rental period details
    • Textbook Rentals in 3 Easy Steps  details
    Note: Access code and/or supplemental material are not guaranteed to be included with textbook rental or used textbook.
  • purchase options
    $189.14 $249.00 Save 24% Current price is $189.14, Original price is $249. You Save 24%.
  • purchase options


Digital Integrated Circuits / Edition 2

Progressive in content and form, this practical book successfully bridges the gap between the circuit perspective and system perspective of digital integrated circuit design. Digital Integrated Circuits maintains a consistent, logical flow of subject matter throughout. Addresses today's most significant and compelling industry topics, including: the impact of interconnect, design for low power, issues in timing and clocking, design methodologies, and the tremendous effect of design automation on the digital design perspective. For readers interested in digital circuit design.

Product Details

ISBN-13: 9780130909961
Publisher: Pearson
Publication date: 01/07/2003
Series: Prentice Hall Electronics and VLSI Ser.
Edition description: REV
Pages: 761
Sales rank: 700,522
Product dimensions: 7.00(w) x 9.20(h) x 1.70(d)

Table of Contents

(NOTE: Each chapter begins with an Introduction and concludes with a Summary, To Probe Further, and Exercises and Design Problems.)


1. Introduction.

A Historical Perspective. Issues in Digital Integrated Circuit Design. Quality Metrics of a Digital Design.

2. The Manufacturing Process.

The CMOS Manufacturing Process. Design Rules—The Contract between Designer and Process Engineer. Packaging Integrated Circuits. Perspective—Trends in Process Technology.

3. The Devices.

The Diode. The MOS(FET) Transistor. A Word on Process Variations. Perspective: Technology Scaling.

4. The Wire.

A First Glance. Interconnect Parameters—Capitance, Resistance, and Inductance. Electrical Wire Models. SPICE Wire Models. Perspective: A Look into the Future.


5. The CMOS Inverter.

The Static CMOS Inverter—An Intuitive Perspective. Evaluating the Robustness of the CMOS Inverter: The Static Behavior. Performance of CMOS Inverter: The Dynamic Behavior. Power, Energy, and Energy-Delay. Perspective: Technology Scaling and Its Impact on the Inverter Metrics.

6. Designing Combinational Logic Gates in CMOS.

Static CMOS Design. Dynamic CMOS Design. How to Choose a Logic Style? Perspective: Gate Design in the Ultra Deep-Submicron Era.

7. Designing Sequential Logic Circuits.

Timing Metrics for Sequential Circuits. Classification of Memory Elements. Static Latches and Registers. Dynamic Latches and Registers. Pulse Registers. Sense-Amplifier Based Registers. Pipelining: An Approach to Optimize Sequential Circuits. Non-Bistable Sequential Circuits. Perspective: Choosing a Clocking Strategy.


8. Implementation Strategies for Digital ICS.

From Custom to Semicustom and Structured-Array Design Approaches. Custom Circuit Design. Cell-Based Design Methodology. Array-Based Implementation Approaches. Perspective—The Implementation Platform of the Future.

9. Coping with Interconnect.

Capacitive Parasitics. Resistive Parasitics. Inductive Parasitics. Advanced Interconnect Techniques. Perspective: Networks-on-a-Chip.

10. Timing Issues in Digital Circuits.

Timing Classification of Digital Systems. Synchronous Design—An In-Depth Perspective. Self-Timed Circuit Design. Synchronizers and Arbiters. Clock Synthesis and Synchronization Using a Phased-Locked Loop. Future Directions and Perspectives.

11. Designing Arithmetic Building Blocks.

Datapaths in Digital Processor Architectures. The Adder. The Multiplier. The Shifter. Other Arithmetic Operators. Power and Spped Trade-Offs in Datapath Structures. Perspective: Design as a Trade-off.

12. Designing Memory and Array Structures.

The Memory Core. Memory Peripheral Circuitry. Memory Reliability and Yield. Power Dissipation in Memories. Case Studies in Memory Design. Perspective: Semiconductor Memory Trends and Evolutions.

Problem Solutions.


Customer Reviews

Most Helpful Customer Reviews

See All Customer Reviews