Electroless Copper and Nickel-Phosphorus Plating: Processing, Characterisation and Modelling

Electroless Copper and Nickel-Phosphorus Plating: Processing, Characterisation and Modelling

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Product Details

ISBN-13: 9780081014974
Publisher: Elsevier Science
Publication date: 09/02/2016
Pages: 304
Product dimensions: 6.14(w) x 9.21(h) x 0.64(d)

About the Author

Professor Wei Sha is Professor of Materials Science at The Queen’s University of Belfast, UK

Dr. Kim Ghee Keong currently resides in Malaysia. All three authors are internationally renowned for their research and work in the electroless field.

Table of Contents

1. Introduction to electroless copper and nickel-phosphorus (Ni-P) depositions

Part I: Electroless copper depositions 2. Surface morphology evolution of electroless copper deposits 3. Cross-section of electroless copper deposits and the void fraction 4. Crystal structure and surface residual stress of electroless copper deposits 5. The atomic model of the diamond pyramid structure in electroless copper deposits 6. Molecular dynamics (MD) simulation of the diamond pyramid structure in electroless copper deposits 7. Adhesion strength of electroless copper deposit to epoxy board 8. Electrical resistivity of electroless copper deposit 9. Applications of electroless copper deposits

Part II: Electroless nickel-phosphorus (Ni-P) depositions 10. Crystallisation of nickel-phosphorus (Ni-P) deposits with high phosphorus content 11. Crystallisation of nickel-phosphorus (Ni-P) deposits with medium and low phosphorus content 12. Modelling the thermodynamics and kinetics of crystallisation of nickel-phosphorus (Ni-P) deposits 13. Artificial neural network (ANN) modelling of crystallisation temperatures of nickel-phosphorus deposits 14. Hardness evolution of nickel-phosphorus (Ni-P) deposits with thermal processing 15. Applications of electroless nickel-phosphorus (Ni-P) plating

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