Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology 2003: Proceedings, ASME International Mechanical Engineering Congress and Exposition, Washington, DC available in Paperback
- Pub. Date:
- American Society of Mechanical Engineers
Proceedings of the ASME International Mechanical Engineering Congress:Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology. November 15-21, 2003 Washington,D.C. Collection of 107 full-length, peer-reviewed technical papers that cover resarch and innovation in the following major topics: Nanotechnology; Electronic and Photonics Packaging; advanced/novel interconnects; application specific MEMS/NEMS packaging and panel; critical issues in accelerated life testing and field reliability; design, simulation, and measurement of MEMS packaging; fabrication and testing of MEMS packaging; general; high density interconnects and 3-D packaging; influence of stresses and defects on nanoelectronics/MEMS performance; lead-free solders; mechanical reliability; micro and nano scale heat transfer in electronics; microelectronics; nanocomposites and emerging materials in microelectronics; photonics; reliability issues in nanoelectronics/ nanoelectromechanical packaging; cooling of microelectronics, MEMS, photonics,and nano devices: in favor of R.C. Chu's sustained contribution to electronic cooling; thermal transport issues in devices and packaging technologies. Electrical Systems and Photonic Design: photonics packaging: process and reliability issues; cooling of microelectronics, MEMS, photonics, and nano devices.