A Guide to Lead-free Solders: Physical Metallurgy and Reliability / Edition 1

by John W. Evans, Werner Engelmaier, Dong-il Kwon

Overview

The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.

Product Details

ISBN-13:	9781849965774
Publisher:	Springer London
Publication date:	10/18/2010
Edition description:	Softcover reprint of hardcover 1st ed. 2007
Pages:	206
Product dimensions:	6.10(w) x 9.25(h) x 0.02(d)

Table of Contents

to Solder Alloys and Their Properties.- Packaging Architecture and Assembly Technology.- Wetting and Joint Formation.- Microstructural Instability in Solders.- Intermetallic Formation and Growth.- Mechanical Properties and Creep Behavior.- Thermomechanical Fatigue.- Product Assurance.